Technical Production Manager

CCA Professional Recruiting; Richardson (TX); On-site; USD 70,000 - 90,000; Full time

Job summary

Technical Production Manager – Semiconductor Backend at CCA Professional Recruiting leads backend manufacturing operations including wafer probe, dicing, and coordinating outsourced assembly and final test with subcontract partners.

The role demands strong technical knowledge of semiconductor backend processes, proven leadership, and the ability to drive production efficiency and quality in a fast-paced environment.

Qualifications

• Bachelor's degree in a relevant engineering field or equivalent experience.
• Minimum 7 years in semiconductor backend manufacturing environments.
• At least 3 years of supervisory or production leadership experience.
• Experience coordinating externally with subcontract assembly and test partners.

Responsibilities

• Lead daily backend semiconductor manufacturing operations including wafer probe, wafer dicing, and wafer saw processes.
• Supervise and mentor a team of 8–12 technicians and production personnel across multiple shifts.
• Manage production schedules, work orders, traveler flow, and material movement between internal and subcontract partners.
• Coordinate outsourced assembly and final test operations to ensure on-time delivery, quality, and yield performance.
• Monitor subcontractor performance, including yields, quality metrics, and delivery commitments.
• Investigate and resolve process excursions, yield losses, and production issues with internal and external partners.

Skills

Leadership

Production planning

Problem solving

Communication

Education

Bachelor's degree in Electrical Engineering, Mechanical Engineering, Manufacturing Engineering, or equivalent

Tools

MES

ERP systems

Lean Manufacturing

SPC

Job description

Technical Production Manager – Semiconductor Backend

Job Type: Full-Time | Exempt

Salary: $70,000 – $90,000 per year (Based on Experience)

About the Role

We are seeking an experienced Technical Production Manager to lead our semiconductor backend manufacturing operations. This position is responsible for overseeing in-house wafer probe, wafer dicing/saw operations, and coordinating outsourced assembly and final test activities with subcontract manufacturing partners.

The ideal candidate will bring strong technical expertise in semiconductor backend processes, proven leadership experience, and the ability to drive production efficiency, quality, and continuous improvement in a fast‑paced manufacturing environment.

Key Responsibilities

• Lead daily backend semiconductor manufacturing operations, including wafer probe, wafer dicing, and wafer saw processes.
• Supervise and mentor a team of approximately 8–12 technicians and production personnel across multiple shifts.
• Manage production schedules, work orders, traveler flow, and material movement between internal manufacturing and subcontract partners.
• Coordinate outsourced assembly and final test operations to ensure on‑time delivery, quality, and yield performance.
• Monitor subcontractor performance, including production yields, quality metrics, and delivery commitments.
• Investigate and resolve process excursions, yield losses, and production issues with internal engineering teams and external manufacturing partners.
• Support New Product Introduction (NPI) by coordinating backend process qualifications and subcontract readiness.
• Ensure compliance with cleanroom protocols, ESD requirements, ISO quality standards, and company procedures.
• Drive continuous improvement initiatives utilizing Lean Manufacturing, 5S, Statistical Process Control (SPC), and yield analysis.
• Develop cross‑training plans to improve workforce flexibility and production coverage.
• Collaborate with Engineering, Planning, Supply Chain, and Quality teams to ensure smooth production execution.

Required Qualifications

• Bachelor's degree in Electrical Engineering, Mechanical Engineering, Manufacturing Engineering, or equivalent industry experience.
• Minimum of 7 years of semiconductor backend manufacturing experience involving wafer probe, wafer saw, assembly, or final test.
• At least 3 years of supervisory or production leadership experience.
• Strong experience managing wafer probe and dicing operations.
• Experience coordinating outsourced semiconductor assembly and test operations.
• Knowledge of Statistical Process Control (SPC), yield analysis, and semiconductor manufacturing processes.
• Experience using MES and/or ERP systems.
• Strong leadership, communication, and problem‑solving skills.
• Ability to manage multiple priorities while maintaining production schedules and quality standards.

Preferred Qualifications

• Experience in a high‑mix, low‑volume semiconductor manufacturing environment.
• Hands‑on experience managing subcontract semiconductor assembly and test suppliers.
• Knowledge of Lean Manufacturing, 5S, Continuous Improvement, and process optimization methodologies.
• Strong analytical skills with the ability to identify and resolve manufacturing process issues.
• Experience supporting New Product Introduction (NPI) and production transfers.
• Combination of office and semiconductor cleanroom environments.
• Frequent collaboration with engineering, planning, quality, and subcontract manufacturing partners.
• Occasional travel to subcontract manufacturing facilities.
• Flexibility to support alternate shifts or international supplier schedules when required.

Physical Requirements

• Ability to work in both office and manufacturing environments.
• Frequently stand, walk, bend, and handle manufacturing materials.
• Ability to lift up to 50 pounds occasionally.
• Must be able to work in a cleanroom environment while following ESD and safety protocols.

Why Join Us?

• Opportunity to lead critical semiconductor backend manufacturing operations.
• Work with cutting‑edge semiconductor technologies.
• Collaborative engineering and manufacturing environment.
• Competitive salary and comprehensive benefits.
• Career growth opportunities within a growing semiconductor organization.