Advanced Semiconductor Module Engineer

Intel Corporation

Hillsboro, Northern (OR, KY)

Hybrid

USD 134,000 - 189,000

Full time

5 days ago
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Job summary

Intel Corporation in Hillsboro, Oregon seeks a Module Development Engineer to join its Technology Development team. You will develop and optimize advanced semiconductor manufacturing processes at one of the world’s leading R&D facilities.

Expect experiments, data-driven improvements, and collaboration with suppliers to push next-gen chip fabrication forward. You will work on process characterization, SPC, DOE, and cutting-edge deposition/etching techniques, with opportunities to contribute to

Qualifications

  • Bachelor’s degree in mechanical engineering, Materials Science, Chemical Engineering, Electrical Engineering, Physics, Chemistry, or a related STEM field, with 4+ years of hands-on semiconductor processing experience OR Master’s degree with 3+ years OR PhD with no prior professional experience.

Responsibilities

  • Develop, optimize, and sustain advanced semiconductor manufacturing processes.
  • Design and execute structured experiments (DOE) to meet device specifications.
  • Conduct feasibility studies and pathfinding for novel device architectures.
  • Collaborate with equipment and materials suppliers to evaluate and implement solutions.
  • Perform process technology feasibility studies using simulations and engineering techniques.
  • Stay current on industry trends to align development with needs.
  • Partner with cross-functional teams to meet goals.

Skills

Process characterization
Statistical Process Control
Design of Experiments
Lithography
Etching
Deposition
CMP
Thin film deposition
Vacuum systems
Opto-mechanics
Python
JMP
MATLAB

Education

Bachelor’s degree in a STEM field
Master’s degree in a relevant field
PhD in a relevant field

Tools

DOE

Job description

Intel Corporation in Hillsboro, Oregon seeks a Module Development Engineer to join its Technology Development team. You will develop and optimize advanced semiconductor manufacturing processes at one of the world’s leading R&D facilities.

Expect experiments, data-driven improvements, and collaboration with suppliers to push next-gen chip fabrication forward. You will work on process characterization, SPC, DOE, and cutting-edge deposition/etching techniques, with opportunities to contribute to

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