Dry Etch Module Technical Staff- MTS/SMTS

Micron Technology, Inc; Boise (ID); On-site; USD 120,000 - 160,000; Full time

Job summary

Micron Technology, Inc in Boise, ID seeks a Dry Etch Module Technical Staff (MTS/SMTS) to lead innovation in Dry Etch processes for advanced DRAM. Ideal candidates must have a Ph.D. or Master's degree and at least 10 years in Dry Etch process development.

You will spearhead technical projects, define roadmaps, and mentor engineers while collaborating cross-functionally to optimize processes. Micron fosters an inclusive workplace and embraces diversity.

Qualifications

• Minimum 10 years of hands-on experience in Dry Etch process development.
• Proven track record of technical leadership in semiconductor process engineering.
• Deep understanding of defect mitigation in plasma etch processes.

Responsibilities

• Lead the development and optimization of Dry Etch processes.
• Mentor and guide developing engineers.
• Collaborate with cross-functional teams for process robustness.

Skills

Technical leadership

Plasma etch mechanisms

Communication

Problem-solving

Cross-functional team leadership

Education

Ph.D. or Master’s degree in relevant field

Tools

Lam etch tools

TEL etch tools

AMAT etch tools

Job description

Dry Etch Module Technical Staff – MTS/SMTS

Micron Technology, Boise, ID – Senior technical leaders in process engineering are sought to join the ID1 team. As a member of technical staff (MTS) or senior member of technical staff (SMTS) reporting directly to the Director of DE/WP/CMP, you will drive innovation in Dry Etch processes for advanced DRAM, lead technical projects, shape the roadmap, and mentor engineers.

Responsibilities

• Lead the development, characterization, and optimization of Dry Etch processes for advanced DRAM structures.
• Collaborate cross‑functionally with integration, metrology, equipment, and R&D teams to ensure process robustness and manufacturability.
• Define and execute technical roadmaps aligned with DRAM scaling requirements and yield improvement goals.
• Evaluate and implement new etch technologies, chemistries, and hardware platforms.
• Mentor and guide developing engineers; foster a culture of innovation and technical excellence.
• Collaborate with equipment vendors and external partners to co‑develop solutions.
• Drive root cause analysis and continuous improvement initiatives for process‑related issues.
• Present findings and recommendations to executive leadership and global teams.

Required Qualifications

• Ph.D. or Master’s degree in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related field.
• Minimum 10 years of hands‑on experience in Dry Etch process development, preferably in DRAM or advanced memory technologies.
• Proven track record of technical leadership in semiconductor process engineering.
• Deep understanding of plasma etch mechanisms, process control, and defect mitigation.
• Experience with advanced etch tools (e.g., Lam, TEL, AMAT) and process characterization techniques.
• Strong analytical, problem‑solving, and communication skills.
• Ability to lead cross‑functional teams and manage complex projects.

Preferred Skills

• Experience with high‑aspect‑ratio etching, critical dimension control, and selectivity challenges in DRAM.
• Familiarity with data analytics, DOE methodologies, and SPC tools.
• Knowledge of integration challenges in sub‑20nm DRAM nodes.

Micron is an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment within the full range of opportunities without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.