Process Integration & Applications Engineer – Packaging

Thintronics®; California (MO); On-site; USD 100,000 - 160,000; Full time

Benefits offered by this job

Medical, dental, and vision insurance

401(k)

Paid time off

Stock options grant

Job summary

Thintronics is seeking an experienced process integration and applications engineer to own the integration and optimization of Thintronics materials into customer production flows. You will design DOEs, troubleshoot excursions, and translate fab-floor insights into feedback for R&D teams.

You will serve as the primary technical liaison with substrate manufacturers and OSAT partners, supporting demonstrator builds, qualifications, pilot builds, and production ramp.

Qualifications

• BS, MS, or PhD in Chemical Engineering, Materials Science, Electrical Engineering, or a related field.
• 5+ years of hands-on process engineering experience in semiconductor packaging or substrate fabrication.
• Direct, working-level experience with FCBGA or advanced organic substrate fabrication.
• Demonstrated proficiency in substrate unit processes: lamination, photolithography, dry processes (DRIE, plasma etching, desmear, PVD/sputtering), wet processes (wet etching, electroless deposition), and other metallization techniques.
• Strong analytical skills, with experience designing and executing DOEs and interpreting process data.

Responsibilities

• Development and deployment of Thintronics advanced packaging substrate processes: modified semi-additive, semi-additive, embedded trench, and back-end-of-line (BEOL)
• Process integration of Thintronics dielectric and conductor materials into FCBGA and advanced organic substrate fabrication flowsOwnership of unit process steps, including lamination, photolithography, dry/wet etch, and copper metallization
• Build-up layer process development and optimization for high-density interconnect structures
• Yield analysis, failure analysis, and root-cause investigation to drive continuous process improvement
• Electrical performance and reliability characterization in support of customer qualifications
• Serving as the primary technical liaison between Thintronics R&D and substrate manufacturer/OSAT partners during material qualification and production ramp
• Translating customer process feedback and application requirements into structured technical inputs for internal materials development
• Building and maintaining working-level relationships with process engineers at customer and partner fabs across Asia
• Participating in technical process reviews with leading semiconductor companies

Skills

DOE design and analysis

Process analytics

Cross-cultural collaboration

High-speed signal integrity

Education

BS/MS/PhD in Chemical Engineering, Materials Science, Electrical Engineering

Tools

Lamination

Photolithography

Dry etching (DRIE, plasma etching)

Wet etching

PVD/Sputtering

Electroless deposition

Job description

Thintronics is seeking an experienced process integration and applications engineer to own the integration and optimization of Thintronics materials into customer production flows. You will design DOEs, troubleshoot excursions, and translate fab-floor insights into feedback for R&D teams.

You will serve as the primary technical liaison with substrate manufacturers and OSAT partners, supporting demonstrator builds, qualifications, pilot builds, and production ramp.