Director, DRAM Packaging & 3D Integration

Micron Technology, Inc.; Boise (ID); On-site; USD 180,000 - 320,000; Full time

Benefits offered by this job

Medical, dental, vision plans

Paid time off

Paid holidays

Job summary

Micron Technology, Inc. in Boise, Idaho, seeks a Director of DRAM Packaging to lead the strategy, development, and execution of advanced packaging across its memory portfolio.

You will define roadmaps, drive architecture innovation, and build a high-performing global engineering organization. The role combines technical depth with business strategy, customer engagement, and digital transformation to accelerate innovation and strengthen Micron’s competitive position.

Qualifications

• Bachelor’s degree in Engineering, Materials Science, Physics, Computer Engineering, or a related technical field.
• 15+ years of semiconductor packaging experience, including delivery of advanced packaging technologies from development through high-volume manufacturing.
• 10+ years of experience leading engineering teams, complex technology programs, or global engineering organizations.
• Demonstrated expertise in advanced packaging technologies, including HBM, LPDRAM, DDR, 3D stacking, heterogeneous integration, or related platforms.
• Proven experience driving business-critical technology decisions through technical analysis, risk assessment, and multi-functional collaboration.

Responsibilities

• Define and execute long-term DRAM packaging strategies that support future product, technology, and business objectives.
• Lead development and deployment of advanced packaging technologies, including HBM, LPDRAM, DDR, 2.5D/3D integration, heterogeneous integration, chiplets, and next-generation interconnect solutions.
• Drive adoption of AI, machine learning, advanced analytics, and digital engineering approaches to improve product development, manufacturing, and engineering productivity.
• Build, develop, and lead a global packaging organization focused on innovation, technical excellence, accountability, and operational execution.
• Partner with design, product engineering, manufacturing, quality, supply chain, and technology development teams to deliver successful products from concept through high-volume manufacturing.
• Establish and maintain strategic relationships with customers, OSAT partners, foundries, suppliers, equipment vendors, and research institutions.
• Lead technology investment decisions through driven benchmarking, cost analysis, risk assessment, and case development.
• Drive organizational performance through scalable engineering processes, automation, knowledge management, and data-driven decision making.

Skills

15+ years experience

10+ years leadership

HBM expertise

3D/2.5D packaging

risk assessment

Education

Bachelor’s in Engineering

Tools

AI workflows

Job description

Micron Technology, Inc. in Boise, Idaho, seeks a Director of DRAM Packaging to lead the strategy, development, and execution of advanced packaging across its memory portfolio.

You will define roadmaps, drive architecture innovation, and build a high-performing global engineering organization. The role combines technical depth with business strategy, customer engagement, and digital transformation to accelerate innovation and strengthen Micron’s competitive position.