Die-to-Wafer Hybrid Bonding Process Engineer

Applied Materials, Inc.; Santa Clara (CA); On-site; USD 147,000 - 203,000; Full time

Benefits offered by this job

Relocation assistance

Bonus program

Stock award program

Job summary

Applied Materials, Inc. is seeking hands-on Process Engineers to drive die-to-wafer (D2W) hybrid bonding R&D at our Santa Clara facility. You will design, optimize, and troubleshoot bonding processes, collect data, and collaborate with cross-functional teams on state-of-the-art packaging technologies.

You will work with cutting-edge equipment, perform DOE-driven experiments, and help translate research into scalable manufacturing. Relocation is available; travel up to 10% may be required.

Qualifications

• Ph.D. or MS in Materials Science, Electrical Engineering, Applied Physics, or a related STEM discipline.
• In-depth knowledge and hands-on experience in die to wafer or wafer to wafer hybrid bonding and related processes.
• Experience with semiconductor equipment (plasma, wet cleaning, overlay/alignment).
• Strong understanding of bond interface physics and statistical process control (DOE, SPC, JMP).

Responsibilities

• Develop die to wafer hybrid bonding processes.
• Surface preparation and plasma activation.
• High-accuracy die placement and alignment.
• Post-bond characterization and process evaluation.
• DOE-driven experiments to understand limits, sensitivities, and trade-offs.
• Own process optimization and drive continuous engineering improvement.

Skills

Die to wafer bonding

Hybrid bonding

DOE

Statistical analysis

Problem solving

Team collaboration

Education

Ph.D. or MS in Materials Science, Electrical Engineering, Applied Physics, or related STEM

Tools

Plasma

Wet clean

Overlay/Alignment

Job description

Applied Materials, Inc. is seeking hands-on Process Engineers to drive die-to-wafer (D2W) hybrid bonding R&D at our Santa Clara facility. You will design, optimize, and troubleshoot bonding processes, collect data, and collaborate with cross-functional teams on state-of-the-art packaging technologies.

You will work with cutting-edge equipment, perform DOE-driven experiments, and help translate research into scalable manufacturing. Relocation is available; travel up to 10% may be required.