Infrared Detector Process Integration Engineer

Teledyne Technologies Incorporated; Camarillo (CA); On-site; USD 142,000 - 189,000; Full time

Job summary

Teledyne Technologies Incorporated seeks a Process Integration Engineer to drive detector process development and integration for HgCdTe and Silicon materials in high-end infrared and visible detector arrays. You will work closely with the wafer processing team in the cleanroom to sustain product performance and production yield.

The role requires strong semiconductor design/manufacturing background and collaboration with cross-functional teams to improve device designs, processing methods and

Qualifications

• Bachelor’s degree in engineering, materials science or chemistry with 5+ years of experience, or Master’s with 3+ years.
• Training in cleanroom operation and lab practices, including ESD handling.

Responsibilities

• Perform wafer fabrication process development and integration.
• Conduct process monitoring, control, and data analysis to improve yield.
• Collaborate with cross-functional teams to solve processing and device-design issues.
• Ensure production activities comply with manufacturing procedures and safety standards (AS9100).
• Utilize MES for data recording, reporting, and tracking line efficiency.

Skills

Semiconductor device design

Process integration

Design of experiments

Statistical data analysis

Manufacturing process control

Verbal & written communication

MS Office

Education

Bachelor's degree in engineering, materials science or chemistry

Master's degree or higher

Tools

SPC software

Layout tools

Job description

Teledyne Technologies Incorporated seeks a Process Integration Engineer to drive detector process development and integration for HgCdTe and Silicon materials in high-end infrared and visible detector arrays. You will work closely with the wafer processing team in the cleanroom to sustain product performance and production yield.

The role requires strong semiconductor design/manufacturing background and collaboration with cross-functional teams to improve device designs, processing methods and