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Ingersoll Rand is seeking a Data Center Thermal Application Engineer to design and deploy advanced cooling solutions for high‑density AI/HPC workloads. You will work with CDU, direct‑to‑chip cooling, dry coolers, and fan walls, defining system‑level architectures and validating performance.
Responsibilities include thermal calculations, supplier collaboration, FAT/SAT coordination, and field deployment support. Strong CFD skills and ASHRAE knowledge are valued.
Ingersoll Rand is seeking a Data Center Thermal Application Engineer to design and deploy advanced cooling solutions for high‑density AI/HPC workloads. You will work with CDU, direct‑to‑chip cooling, dry coolers, and fan walls, defining system‑level architectures and validating performance.
Responsibilities include thermal calculations, supplier collaboration, FAT/SAT coordination, and field deployment support. Strong CFD skills and ASHRAE knowledge are valued.