Data Center Thermal Engineer - High-Density Cooling

Ingersoll Rand

West Chester (Chester County)

On-site

USD 120,000 - 170,000

Full time

14 days+

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Benefits offered by this job

Health care options
Dental & vision coverage
401(k) plan
Paid time off
Employee stock grant

Job summary

Ingersoll Rand is seeking a Data Center Thermal Application Engineer to design and deploy advanced cooling solutions for high‑density AI/HPC workloads. You will work with CDU, direct‑to‑chip cooling, dry coolers, and fan walls, defining system‑level architectures and validating performance.

Responsibilities include thermal calculations, supplier collaboration, FAT/SAT coordination, and field deployment support. Strong CFD skills and ASHRAE knowledge are valued.

Qualifications

  • Bachelor’s degree in Mechanical Engineering (Thermal emphasis) required.
  • 5+ years of data center cooling, thermal engineering or HVAC experience.
  • Hands-on experience with CDU and liquid cooling systems.
  • Familiarity with high-density data center cooling and ASHRAE guidelines.

Responsibilities

  • Design thermal solutions using liquid cooling and high‑performance air cooling.
  • Define system‑level cooling architectures integrating CDU loops and rack cooling.
  • Evaluate and optimize airflow strategies including containment and fan walls.
  • Perform thermal calculations, sizing, and redundancy planning.
  • Interface with CDU, Dry Cooler, and fan array suppliers; validate designs.
  • Coordinate FAT/SAT testing and support deployment, installation and commissioning.
  • Collaborate with cross‑functional teams to resolve thermal issues and improve efficiency.

Skills

PM skills
Leadership
Communication
Attention to detail
Stakeholder mgmt
Risk mgmt

Education

Bachelor’s degree in Mechanical Engineering

Tools

6SigmaDCX
ANSYS Icepak
FloTHERM

Job description

Ingersoll Rand is seeking a Data Center Thermal Application Engineer to design and deploy advanced cooling solutions for high‑density AI/HPC workloads. You will work with CDU, direct‑to‑chip cooling, dry coolers, and fan walls, defining system‑level architectures and validating performance.

Responsibilities include thermal calculations, supplier collaboration, FAT/SAT coordination, and field deployment support. Strong CFD skills and ASHRAE knowledge are valued.

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