Data Center Thermal Engineer: Fast-Track Product Design

Vertiv Group Corporation; Delaware (OH); On-site; USD 95,000 - 130,000; Full time

Job summary

Vertiv Group Corporation seeks a Mechanical Engineer – Thermal to join the global NPD team designing data center infrastructure, including liquid cooling and HVAC integration.

You will own designs from concept to release, perform CFD and BOM generation, and balance performance, cost, and manufacturability in a fast-paced environment.

Travel up to 15-25% may be required to support supplier reviews and prototype builds.

Qualifications

• Bachelor's degree in Mechanical Engineering or related field.
• 3–5 years of product development experience in data center infrastructure.
• Strong thermodynamics, heat transfer, and fluid mechanics knowledge.
• Experience with BIM/CAD tools and release documentation.
• Experience collaborating with cross-functional teams and suppliers.

Responsibilities

• Develop thermal designs for data center infrastructure products.
• Translate requirements into architectures and designs.
• Integrate liquid cooling, HVAC, and airflow subsystems.
• Perform thermal, fluid, energy calculations and component selections.
• Create BIM/3D models, drawings, BOMs, and release docs.
• Lead prototype testing, CFD coordination, and design verification.
• Collaborate with multiple teams to deliver integrated solutions.
• Support supplier selection and manufacturability reviews.
• Provide production and field support during builds.
• Lead design reviews and trade-off discussions.
• Research emerging cooling technologies.

Skills

Communication

Problem solving

Innovation

Curiosity

Decision making

Education

Bachelor's degree in Mechanical Engineering

Advanced degree preferred

Tools

Revit

Inventor

AutoCAD

Creo

SolidWorks

Job description

Vertiv Group Corporation seeks a Mechanical Engineer – Thermal to join the global NPD team designing data center infrastructure, including liquid cooling and HVAC integration.

You will own designs from concept to release, perform CFD and BOM generation, and balance performance, cost, and manufacturability in a fast-paced environment.

Travel up to 15-25% may be required to support supplier reviews and prototype builds.