Data Center Interconnect Architect - High-Speed

AMD; Austin (TX); On-site; USD 120,000 - 170,000; Full time

Job summary

AMD is seeking a Data Center System Interconnect Engineer in Austin, TX to lead the design and qualification of high-speed connectors, cables, and sockets that underpin modern server architectures. You will drive signal integrity, reliability, and manufacturability across multi-node platforms.

The role requires hands-on leadership, strong collaboration with packaging, board, and system teams, and a track record of qualifying interconnect technologies for hyperscale deployments.

Qualifications

• Hands-on hands-on, system-level interconnect engineering leadership with experience developing and qualifying high-speed connectors, cables, sockets, and blind-mate interfaces.
• MS/PhD in a technical engineering field preferred and demonstrated ability to lead supplier development and qualification.

Responsibilities

• Own end-to-end development of high-speed interconnect components—connectors, cables, and sockets—optimized for data center platforms.
• Architect advanced interconnect solutions for emerging packaging technologies and multi-node systems.
• Lead validation through signal integrity, mechanical reliability testing, and industry-standard compliance.
• Develop and qualify interconnect ecosystems including test boards, fixtures, and evaluation methodologies for high-volume manufacturing.
• Manage multi-supplier programs to accelerate innovation and maintain robust supply chains.

Skills

High-speed interconnects

Blind mate connectors

Signal integrity

CAD tools

Project leadership

Vendor management

Education

MS in Mechanical, Electrical, Materials, or Systems Engineering

Tools

AutoCAD

SolidWorks

LabVIEW

MATLAB

JMP

Job description

AMD is seeking a Data Center System Interconnect Engineer in Austin, TX to lead the design and qualification of high-speed connectors, cables, and sockets that underpin modern server architectures. You will drive signal integrity, reliability, and manufacturability across multi-node platforms.

The role requires hands-on leadership, strong collaboration with packaging, board, and system teams, and a track record of qualifying interconnect technologies for hyperscale deployments.