Data Center Cooling Solutions Architect

Han's Laser Technology Industry Group Co., Ltd; San Jose (CA); On-site; USD 200,000 - 250,000; Full time

Job summary

Han’s Laser is seeking an experienced Technical Solutions Manager to bridge North American customers with our global R&D and engineering teams. You will serve as the regional technical expert for our data center liquid cooling portfolio, leading discovery, solution design, pre-sales, and product localization to meet NA requirements.

Responsibilities include developing proposals and architectures for CDU, direct-to-chip cold-plate, RDHx, chiller deployments; reviewing P&IDs and hydraulic designs;

Qualifications

• Bachelor’s degree in Mechanical, Thermal, Electrical engineering or related field.
• 5+ years in solutions engineering, applications engineering, or thermal engineering.
• Experience with data center liquid cooling and high-density thermal management.

Responsibilities

• Lead technical discovery, workshops, and pre-sales engagements for data center liquid cooling.
• Develop technical proposals, architectures, and sizing calculations.
• Review hydraulic designs and control sequences.
• Advise on integration with facility infrastructure and existing cooling systems.
• Provide technical training and support to sales teams and partners.
• Support proof-of-concept projects and pilot deployments.

Skills

Technical pre-sales

Thermal engineering

Data center cooling

P&ID review

System architecture

Cross-functional collaboration

Education

Bachelor’s degree in Mechanical Engineering

Master’s degree preferred

Tools

CFD

Thermal modeling

Hydraulic sizing

Job description

Han’s Laser is seeking an experienced Technical Solutions Manager to bridge North American customers with our global R&D and engineering teams. You will serve as the regional technical expert for our data center liquid cooling portfolio, leading discovery, solution design, pre-sales, and product localization to meet NA requirements.

Responsibilities include developing proposals and architectures for CDU, direct-to-chip cold-plate, RDHx, chiller deployments; reviewing P&IDs and hydraulic designs;