Cryogenic TSV & 3D Packaging Engineer

GlobalFoundries; New York (NY); On-site; USD 98,000 - 176,000; Full time

Job summary

GlobalFoundries Fab8 in New York is seeking an R&D TSV engineer to own development and integration of cryogenic, superconducting TSV technologies for high-density vertical interconnects in quantum packaging from concept to manufacturing.

You will lead TSV process development, define architectures, optimize designs for low loss and cryogenic stability, and drive end-to-end integration across etch, deposition, dielectric, metallization, thinning, and 2.5D/3D packaging.

Qualifications

• Master’s degree in Electrical, Mechanical, Chemical Engineering, Materials Science or related field.
• MS degree with at least 8 years of related work experience and GPA 3.0 or better.
• English language fluency (written and verbal).
• Up to 20% travel.

Responsibilities

• Lead development of TSV processes for cryogenic and superconducting applications.
• Define TSV architectures including superconducting liners, dielectric isolation, and via geometries.
• Own end-to-end TSV integration flows across etch, liner deposition, dielectric, metallization, thinning, and backside processing.
• Drive process integration planning to enable prototyping and qualification across programs.
• Collaborate with device/test teams to ensure cryogenic electrical performance and low loss for superconducting operation.

Skills

TSV development

Communication skills

Project management

Education

Master’s in Electrical/Mechanical/Chemical Engineering or Materials Science

PhD preferred

Tools

DRIE

PVD/CVD/ALD

Wafer thinning

Job description

GlobalFoundries Fab8 in New York is seeking an R&D TSV engineer to own development and integration of cryogenic, superconducting TSV technologies for high-density vertical interconnects in quantum packaging from concept to manufacturing.

You will lead TSV process development, define architectures, optimize designs for low loss and cryogenic stability, and drive end-to-end integration across etch, deposition, dielectric, metallization, thinning, and 2.5D/3D packaging.