Compact Modeling Engineer – Semiconductors

Intel Corporation; Hillsboro (OR); On-site; USD 174,000 - 330,000; Full time

Job summary

Intel Corporation in Hillsboro, Oregon seeks a Semiconductor Device Modeling Engineer to support compact modeling activities for Intel's advanced process technologies. You will collaborate with design teams to optimize models for data-centric applications and leverage state-of-the-art tools.

The role requires expertise in BSIM-CMG, extraction tools, and simulators like HSPICE and Spectre, plus strong IV/CV fitting and model retargeting skills. On-site work is expected.

Qualifications

• Master’s degree in Electrical Engineering or related field with 5+ years of semiconductor experience; or Ph.D. with 3+ years in the semiconductor field.
• 3+ years hands-on experience with BSIM-CMG and other compact models for transistor modeling at advanced nodes (e.g., FinFET, GAA).
• Proficiency with extraction tools (ICCAP, MBP) and commercial simulators such as HSPICE, Spectre, etc.
• Strong background in IV/CV fitting, model retargeting, and corner/statistical variation modeling.
• Experience developing LLE models for FinFET or GAAFET technologies.
• Skilled in Python scripting for automation and documentation.

Skills

IV/CV fitting

Python scripting

Transistor modeling

Education

Master's degree in Electrical Engineering

Ph.D. in Electrical Engineering

Tools

HSPICE

Spectre

ICCAP

MBP

Job description

Intel Corporation in Hillsboro, Oregon seeks a Semiconductor Device Modeling Engineer to support compact modeling activities for Intel's advanced process technologies. You will collaborate with design teams to optimize models for data-centric applications and leverage state-of-the-art tools.

The role requires expertise in BSIM-CMG, extraction tools, and simulators like HSPICE and Spectre, plus strong IV/CV fitting and model retargeting skills. On-site work is expected.