Semiconductor Device Modeling Engineer

Intel

Phoenix (AZ)

Hybrid

USD 150,000 - 285,000

Full time

14 days+
Application generator

Turn this role into an interview — a resume and cover letter built around what this employer wants.

Get past ATS filters

Job summary

Intel is seeking a Semiconductor Device Modeling Engineer to characterize device behavior and create/update models for new technologies, ensuring accurate simulations and reliable results.

The role involves working within CDMG in Intel's Design Enablement organization, contributing to co-optimization of state-of-the-art process technologies for data-centric products.

Qualifications

  • Master's degree in Electrical Engineering or related field with 3+ years in semiconductors.
  • PhD in Electrical Engineering or related field with 1+ year in industry or research on semiconductor devices.
  • Hands-on experience in Python or C, Shell programming.
  • Experience or coursework in semiconductor device physics, process flow, layout and basic circuit design/simulation.
  • Ability to work independently after ramp-up.

Responsibilities

  • Characterize device behavior and generate/update device models for new technologies, ensuring robust and accurate simulations.

Skills

Python
C
Shell
Semiconductor physics
Independence

Education

Master's degree in Electrical Engineering
PhD in Electrical Engineering

Tools

ICCAP
MBP
HSPICE
SPECTRE
Cadence
Virtuoso

Job description

About The Team

The Compact Device Modeling Group (CDMG) is part of Intel's Design Enablement (DE) organization. DE is a key pillar in enabling Intel to deliver design, development, and manufacturing services that allow internal and external customers to bring winning products to the marketplace. Your work will directly enable design teams to get to market faster with leadership products based on innovative technologies.

Job Details

Job Description:

About The Team

The Compact Device Modeling Group (CDMG) is part of Intel's Design Enablement (DE) organization. DE is a key pillar in enabling Intel to deliver design, development, and manufacturing services that allow internal and external customers to bring winning products to the marketplace. Your work will directly enable design teams to get to market faster with leadership products based on innovative technologies.

As a member of CDMG, you will be at the forefront of co‑optimizing Intel's state‑of‑the‑art process technology, enabling customers with diverse design needs to deliver best‑in‑class products for data‑centric applications.

As a Semiconductor Device Modeling Engineer, you will be responsible for characterizing device behavior and generating/updating device models for new technologies while ensuring robust and accurate model simulations.

Qualifications

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications
  • Master's degree in Electrical Engineering or a related discipline with a minimum of 3+ years of industry experience in the semiconductor field; OR
  • PhD in Electrical Engineering or a related discipline with a minimum of 1 year of industry or research experience and a dissertation focused on semiconductor devices or processes.
  • Hands‑on experience in Python or C, Shell programming.
  • Experience or course work in semiconductor device physics, process flow, layout and simple circuit design and simulation.
  • The ability to work independently after the initial ramp‑up time.
Preferred Qualifications
  • A Ph.D. degree in electrical engineering or related discipline with 3 + years of industry experience in the semiconductor field.
  • Experience in BSIM models and other compact models, extraction tools (ICCAP or MBP), and commercially available simulators. (example: HSPICE, SPECTRE, etc.)
  • Understanding of corner, statistical and sub‑circuit models and their usages.
  • Understanding of layout effects and models.
  • Understanding of basic analog and digital circuit blocks and model interaction.
  • Hands‑on experience in semiconductor device DC/CV characterization tools, techniques, and systems. Experience in test automation and RF/noise/reliability tests is a plus.
  • Understanding of Aging Simulations and reliability methodologies and tools is a plus.
  • Experienced in a Cadence design environment, including schematic capture, analog design environment, virtuoso layout design, DRC, LVS, and layout extractions.
Job Type

Experienced Hire

Shift

Shift 1 (United States of America)

Primary Location

US, California, Santa Clara

Additional Locations

US, Arizona, Phoenix, US, Oregon, Hillsboro

Posting Statement
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation or ordinance.
Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $149,600.00 - 284,580.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job‑related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on‑site at their assigned Intel site and off‑site. * Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

Get your free, confidential resume review.

or drag and drop your file here.

Similar jobs

Similar jobs worth comparing

Staff Semiconductor Device Modeling Engineer
Staff Semiconductor Device Modeling Engineer

Intel • Santa Clara (CA)

On-site
USD 150,000 - 285,000
Stock bonuses
Health benefits
Paid time off
Staff Semiconductor Device Modeling Engineer
Staff Semiconductor Device Modeling Engineer

Intel • Hillsboro (OR)

On-site
USD 150,000 - 285,000
Stock bonuses
Health benefits
Retirement plan
+1
Semiconductor Research Integration Engineer
Semiconductor Research Integration Engineer

Intel • Hillsboro (OR)

On-site
USD 142,000 - 200,000
Stock bonuses
Health benefits
Retirement plan
+1
Foundry Device Engineer
Foundry Device Engineer

Intel • Hillsboro (OR)

On-site
USD 162,000 - 318,000
Stock bonuses
Health insurance
Retirement plan
+1
Foundry Device Engineer
Foundry Device Engineer

Intel • Santa Clara (CA)

On-site
USD 162,000 - 318,000
Stock bonuses
Health insurance
Hybrid work model
LTD Advanced Device Development Engineer
LTD Advanced Device Development Engineer

Intel Corporation • Hillsboro (OR)

On-site
USD 137,000 - 269,000
Competitive pay
Stock bonuses
Health plans
+2
Intel Foundry Advanced Device Development Engineer
Intel Foundry Advanced Device Development Engineer

Intel Corporation • Hillsboro (OR)

On-site
USD 137,000 - 193,000
Stock bonuses
Health benefits
Retirement benefits
+1
Advanced Packaging Singulation Engineer
Advanced Packaging Singulation Engineer

Intel Corporation • Rio Rancho (NM)

On-site
USD 121,000 - 171,000
Competitive pay
Stock bonuses
Benefits package
Thermal Analysis Engineer
Thermal Analysis Engineer

Intel Corporation • Chandler (AZ)

On-site
USD 164,000 - 232,000
Competitive pay
Stock bonuses
Health benefits
+2
Advanced Packaging Module Development Engineer
Advanced Packaging Module Development Engineer

intel • Hillsboro (OR)

On-site
USD 134,000 - 255,000
Health benefits
Stock bonuses
Retirement plan
+1