Co-Op: Mechanical Packaging Engineer for 3D CAD & Thermal

NOKIA; New York (NY); On-site; USD 22,000 - 36,000; Full time

Job summary

Nokia is seeking a 4-month onsite internship in Sunnyvale, CA or New York, NY for MS/PhD students in mechanical engineering or related fields. You will perform mechanical integrity and thermal simulations, support packaging components, and develop manufacturing drawings using 3D CAD tools.

Applicants should have 3D CAD and GD&T experience, DFx knowledge, and strong communication skills to collaborate with engineers and vendors.

Qualifications

• Current MS/PhD student in mechanical engineering, physics, or related field.
• Experience with 3D CAD, tolerance analysis, and GD&T.
• Knowledge of Design for Manufacturing (DFx).
• Strong communication and problem-solving skills.

Responsibilities

• Perform mechanical integrity and thermal simulations, tolerance analyses and characterization.
• Support advanced packaging components and test fixtures for new products using 3D software and generate manufacturing drawings.
• Apply in-depth knowledge of Design for Manufacturing principles and stay current with new technological advancements.
• Drive package debug activities during product validation and qualification.

Skills

3D CAD

Tolerance analysis

GD&T

SolidWorks

Thermal simulation

Thermo-mechanical

ANSYS

Documentation

Interpersonal skills

Vendor collaboration

Education

MS/PhD student

Tools

SolidWorks

ANSYS

3D CAD tools

Job description

Nokia is seeking a 4-month onsite internship in Sunnyvale, CA or New York, NY for MS/PhD students in mechanical engineering or related fields. You will perform mechanical integrity and thermal simulations, support packaging components, and develop manufacturing drawings using 3D CAD tools.

Applicants should have 3D CAD and GD&T experience, DFx knowledge, and strong communication skills to collaborate with engineers and vendors.