CMP Process Engineer — Yield & NPI, Tool Qualification, Equity

Frontdoor Defense; Fort Collins (CO); Hybrid; USD 91,000 - 146,000; Full time

Benefits offered by this job

Annual bonus

Equity grants

401(k) matching

Medical/dental/vision

Job summary

Broadcom is seeking a CMP Process Engineer in Fort Collins, Colorado to lead CMP process optimization and qualification to improve wafer yield. You will partner with Equipment Engineers, Industrial Engineering, R&D, and external vendors to scale high-volume manufacturing and technology development.

You will monitor SPC charts, perform root-cause analysis, develop robust processes for NPI, and document procedures for operators to ensure consistent outcomes with strong ownership across teams.

Qualifications

• B.S. in Chemical Engineering, Mechanical Engineering, or related field.
• 5 years of experience in semiconductor manufacturing; CMP experience preferred.
• Experience maintaining an established process and monitoring inline data.
• Strong teamwork and communication; ability to partner with Operations and Technicians.
• DOE, characterization, optimization, and data-driven problem solving; SPC proficiency.

Responsibilities

• Sustain daily CMP operations by monitoring SPC charts and responding to issues.
• Investigate defects using root-cause analysis within a PDCA framework.
• Develop, characterize, and optimize processes for NPI and technology development.
• Collaborate with Operators, Process Technicians, and other teams to drive improvements.
• Qualify new tools and recipes with rigorous qualification plans; assess impact on cost and throughput.
• Document procedures to ensure consistent tool operation and outcomes.

Skills

CMP

Process optimization

SPC monitoring

DOE

Data analysis

Lean manufacturing

Six-Sigma

Documentation

Cross-functional collaboration

FDC/PDCA

Education

Bachelor's degree in Chemical Engineering or Mechanical Engineering

Tools

JMP

Spotfire

Excel

SPACE

Job description

Broadcom is seeking a CMP Process Engineer in Fort Collins, Colorado to lead CMP process optimization and qualification to improve wafer yield. You will partner with Equipment Engineers, Industrial Engineering, R&D, and external vendors to scale high-volume manufacturing and technology development.

You will monitor SPC charts, perform root-cause analysis, develop robust processes for NPI, and document procedures for operators to ensure consistent outcomes with strong ownership across teams.