Chemical Mechanical Planarization (CMP) Process Engineer

Broadcom Inc.; Fort Collins (CO); On-site; USD 91,000 - 146,000; Full time

Benefits offered by this job

Discretionary annual bonus

Equity grant

Annual equity awards

ESPP

Employee Assistance Program (EAP)

Paid holidays

Job summary

Broadcom Inc. in Fort Collins, CO, is seeking a CMP Process Engineer for the Finish Team to develop, optimize, and qualify CMP processes in a high-volume wafer fab. You will partner with Equipment Engineers, R&D, and vendors to drive yield, device performance, and process capability.

Responsibilities include sustaining daily CMP operations, root-cause analysis, DOE and process qualification, and documenting procedures. A BS in engineering and 5 years in semiconductor manufacturing are required.

Qualifications

• 5 years of experience in semiconductor manufacturing; CMP experience preferred.
• Experience maintaining an established process, monitoring inline data, and responding to yield/quality issues.
• DOE, characterization, and optimization capabilities.
• Strong collaboration with Operations and Process Technician teams.
• Solid setup, process qualification plans, and data analysis skills.

Responsibilities

• Sustain daily CMP operations by monitoring SPC charts and responding to issues.
• Investigate and correct manufacturing defects via root-cause analysis (PDCA).
• Develop, characterize, and optimize CMP processes for NPI and higher yield.
• Communicate changes to stakeholders and document procedures for operators.

Skills

SPC

DOE

Data analysis

Problem solving

Education

Chemical Engineering

Mechanical Engineering

Tools

JMP

Spotfire

SPACE

Excel

Job description

Job Description: The Wireless Semiconductor Division (WSD) designs and develops highly integrated, state-of-the-art RF front-end solutions for use in mobile communications and WiFi access points. Together, we’re enabling our customers to distinguish their products using Broadcom’s differentiated RF semiconductors. As a CMP Process Engineer in the Finish Team, you will be responsible for developing, optimizing, and ensuring the quality of CMP processes within the wafer fabrication facility located in Fort Collins, Colorado. You will work closely with Equipment Engineers, Industrial Engineering, R&D, and external Vendors to meet the needs of high volume manufacturing and technology development with process capability.

Roles & Responsibilities:

• Sustain daily CMP operations by monitoring statistical process control (SPC) charts and responding to lot holds, tool issues, and fault detection & classification (FDC) interdiction events.
• Investigate and correct manufacturing defects, scrap, and other issues using root-cause analysis within a Plan-Do-Check-Act (PDCA) system.
• Develop, characterize, and optimize processes to enable new product introduction (NPI), support new technology from R&D teams, increase wafer yield, and improve device performance.
• Work closely with and communicate changes to stakeholders at various levels of the organization, including Operators and Process Technicians.
• Qualify new tools and recipes through the design and execution of rigorous process qualification plans while evaluating the impact on cost, throughput, capacity, and other factors.
• Collaborate with integration, yield, procurement, and other teams to implement continuous improvement projects within the area of ownership.
• Document procedures for Operators and other tool users to enable their operation of the equipment for the desired outcomes.

Qualifications:

• B.S. in Chemical Engineering, Mechanical Engineering, or related field.
• 5 years of experience working in semiconductor manufacturing, CMP experience preferred.
• Experience maintaining an established process, monitoring inline data, and responding proactively to issues affecting Yield and/or Quality.
• Excellent teamwork and good verbal and written communication skills.
• Demonstrated strong partnership skills with teams like Operations and Process Technician organizations.
• Good problem solving skills, sound analytical techniques, and an ability to solve problems systematically.
• Design of Experiment (DOE), characterization, and optimization capabilities.
• Strong understanding of SPC and proficiency with data science and SPC software (JMP, Spotfire, SPACE, Excel, etc).
• Familiarity applying Lean manufacturing, Six-Sigma, and similar principles to complex issues.
• Demonstrates good judgment in selecting methods and techniques for obtaining solutions.
• Strong sense of ownership and willingness to work across organizational boundaries to resolve issues.

Compensation and Benefits

The annual base salary range for this position is USD 91,100.00 To USD 146,000.00

As a valued member of our team, you’ll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company’s growth. All subject to relevant plan documents and award agreements.

Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESP P), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time.

The company follows all applicable laws for Paid Family Leave and other leaves of absence.

Broadcom is proud to be an equal opportunity employer.

We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law.

We will also consider qualified applicants with arrest and conviction records consistent with local law.

If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.

Welcome! Thank you for your interest in Broadcom! We are a global technology leader that designs, develops and supplies a broad range of semiconductor and infrastructure software solutions. For more information please visit our video library and check out our Connected by Broadcom series. Follow us on Linked In Broadcom Inc.