AI-Driven EUV Mask Tech FEOL R&D Engineer

1000 Micron Technology, Inc.; Boise (ID); On-site; USD 110,000 - 150,000; Full time

Benefits offered by this job

Medical insurance

Dental insurance

Vision insurance

Paid time off

Paid holidays

Job summary

Micron Technology, at the Mask Technology Center, seeks a seasoned researcher to advance AI-assisted EUV mask materials and processes. You will work with cross‑functional teams to design film stacks, deposition, etching, and patterning quality, contributing to High‑NA EUV readiness and robust manufacturable mask solutions.

The role requires an MS/PhD in a relevant field and 2+ years in semiconductor manufacturing or related research, with preference for experience in EUV/advanced nodes and mask

Qualifications

• MS/PhD in a relevant field required.
• 2+ years of experience in semiconductor manufacturing or R&D.
• Experience with lithography, EUV, or mask materials preferred.

Responsibilities

• Develop AI-assisted EUV mask blank materials and processes, including film stack design, deposition, etch, clean, and patterning quality.
• Advance High‑NA EUV readiness through material selection, mask design, stitching, lithography performance optimization, and lifetime improvement.
• Translate lithography requirements into manufacturable mask solutions in collaboration with OPC, design, and lithography teams.
• Conduct data‑driven R&D using DOE and fundamental analysis to improve yield, reliability, and manufacturability.
• Collaborate with cross‑functional engineering teams to transition new technologies into FEOL process engineering.

Skills

Semiconductor manufacturing experience

DOE analysis

Education

MS or PhD in Materials Science, Physics, Chemistry, Chemical Engineering, or related field

Job description

Micron Technology, at the Mask Technology Center, seeks a seasoned researcher to advance AI-assisted EUV mask materials and processes. You will work with cross‑functional teams to design film stacks, deposition, etching, and patterning quality, contributing to High‑NA EUV readiness and robust manufacturable mask solutions.

The role requires an MS/PhD in a relevant field and 2+ years in semiconductor manufacturing or related research, with preference for experience in EUV/advanced nodes and mask