EUV Mask R&D Engineer — AI-Assisted High-NA Readiness

Micron Technology, Inc; Boise (ID); On-site; USD 110,000 - 170,000; Full time

Benefits offered by this job

Medical plan

Dental plan

Vision plan

Paid time off

Paid holidays

Paid family leave

Job summary

Micron Technology, Inc. in Boise, ID, is seeking an EUV Mask Technology R&D Engineer to advance High‑NA EUV readiness and develop mask materials and processes.

You will work with cross‑functional teams, perform data‑driven DOE studies, and translate lithography requirements into manufacturable mask solutions for next‑gen DRAM scaling.

Preferred candidates hold an MS/PhD in a related field with 2+ years in semiconductor research or manufacturing and are familiar with EUV/BEOL/FEOL processes.

Qualifications

• MS or PhD in Materials Science, Physics, Chemistry, Chemical Engineering, or related field.
• 2+ years of experience in semiconductor manufacturing, process development, or equivalent academic research in semiconductor technologies.
• Experience with EUV, High-NA EUV mask materials or related lithography environments is a plus.

Responsibilities

• Develop AI assisted EUV mask blank materials and processes, including film stack design, deposition, etch, clean, and patterning quality
• Advance High‑NA EUV readiness through material selection, mask design, stitching, lithography performance optimization, and lifetime improvement
• Translate lithography requirements into manufacturable mask solutions in collaboration with OPC, design, and lithography teams
• Conduct data‑driven R&D using DOE and fundamental analysis to improve yield, reliability, and manufacturability
• Collaborate with cross‑functional engineering teams to transition new technologies into FEOL process engineering

Skills

DOE data analysis

Cross-functional collaboration

Lithography fundamentals

Education

MS or PhD in Materials Science, Physics, Chemistry, Chemical Engineering, or related field

Tools

Actinic mask inspection

Mask repair

Job description

Micron Technology, Inc. in Boise, ID, is seeking an EUV Mask Technology R&D Engineer to advance High‑NA EUV readiness and develop mask materials and processes.

You will work with cross‑functional teams, perform data‑driven DOE studies, and translate lithography requirements into manufacturable mask solutions for next‑gen DRAM scaling.

Preferred candidates hold an MS/PhD in a related field with 2+ years in semiconductor research or manufacturing and are familiar with EUV/BEOL/FEOL processes.