AI Data Center High-Speed Interconnect Architect

BizLink Group; Fremont (CA); On-site; USD 180,000 - 280,000; Full time

Job summary

BizLink Group in Fremont, CA is seeking a Senior High-Speed Interconnect Architect to define the architecture for advanced AI servers and rack systems, including backplanes, co-packaged copper, OSFP, PCIe, and OSFP-X. You will balance performance, signal integrity, power, and manufacturability.

Collaborate with hardware, system, packaging, and software teams; engage with standards bodies such as PCI-SIG, IEEE, and CXL; contribute to roadmaps and technical specifications for scalable interconnect

Qualifications

• Minimum of 10 years of professional experience in high-speed interconnect architecture, signal integrity, or system design for AI/HPC platforms.
• Extensive expertise in high-speed protocols (NVLINK, UALINK, PCIe, CXL, Ethernet, InfiniBand, OSFP, OSFP-X) and advanced connector/cabling technologies.
• Comprehensive knowledge of signal integrity, power integrity, PCB/package/system design, and relevant simulation tools.
• Proven experience in participating in or influencing industry standards development.

Responsibilities

• Architectural Design and Optimization of high-speed interconnect solutions for AI/ML and HPC platforms.
• Technology Assessment of interconnect standards and future scalability.
• Signal and Power Integrity collaboration with engineers to ensure robust data transmission.
• Interdepartmental collaboration with hardware, system, packaging, and software teams.
• Industry Standards Participation in bodies like OCP, PCI-SIG, and CXL Consortium.
• Client and Partner Liaison to align requirements and foster collaboration.
• Technical Documentation and roadmapping for high-speed interconnects.

Skills

10+ years exp

Electrical Eng

Signal Integrity

Power Integrity

PCB/Package Design

Cross-functional Leadership

Standards Bodies

Education

Electrical/Computer Engineering degree

Job description

Overview Of The Position

The High-Speed Interconnect Architect will define and engineer the architecture for advanced high-speed interconnect systems integral to next-generation AI servers and rack configurations. This entails the development of technologies such as high-speed backplanes (NVLINK, UALINK), co-packaged copper, high-speed cables, PCIe, CXL, OSFP, OSFP-X, 448G/lane technology, and sophisticated onboard connectors. The architect will ensure these solutions satisfy stringent demands for bandwidth, latency, signal integrity, scalability, and reliability within high-density AI and HPC environments. This position necessitates close collaboration with interdisciplinary teams and active participation in industry standardization bodies to propel innovation and adoption. This role is crucial for the realization of next-generation, scalable, high-performance AI infrastructure through advancements in interconnect technology.

Key Responsibilities

• Architectural Design and Optimization: Architect and optimize high-speed interconnect solutions, including backplanes, co-packaged copper, OSFP, OSFP-X, and onboard connectors, for AI/ML and HPC platforms. Achieve equilibrium among performance, signal integrity, power consumption, cost efficiency, and manufacturing feasibility.
• Technology Assessment: Lead the assessment and selection of interconnect technologies (e.g., NVLINK, UALINK, PCIe, CXL), considering evolving standards and future scalability imperatives.
• Signal and Power Integrity Management: Collaborate with signal and power integrity engineers to ensure robust high-speed data transmission and adherence to electrical and EMI/EMC standards.
• Interdepartmental Collaboration: Engage with hardware, system, packaging, and software development teams to integrate interconnect solutions into AI server and rack architectures.
• Industry Standards Participation: Represent the organization in standards bodies (e.g., OCP, PCI-SIG, UALINK, IEEE, CXL Consortium), influence the formulation of next-generation interconnect standards, and monitor industry trends.
• Client and Partner Liaison: Interact with hyperscalers, OEMs, and technology partners to ascertain requirements, address challenges, and facilitate the collaborative development of innovative solutions.
• Technical Documentation and Strategic Planning: Author technical specifications, architecture documents, and contribute to the product roadmap for high-speed interconnects.

Job Requirements

• Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or a related discipline.
• Minimum of 10 years of professional experience in high-speed interconnect architecture, signal integrity, or system design for compute, networking, or AI platforms.
• Extensive expertise in high-speed protocols (NVLINK, UALINK, PCIe, CXL, Ethernet, InfiniBand, OSFP, OSFP-X) and advanced connector/cabling technologies.
• Comprehensive knowledge of signal integrity, power integrity, PCB/package/system design, and relevant simulation tools.
• Proven experience in participating in or influencing industry standards development.
• Exceptional communication and cross-functional leadership proficiencies.
• Familiarity with hardware/software co-design and performance analysis for AI/HPC workloads is advantageous.