Aerosol Jet Applications Engineer — Demos & R&D

Optomec

Saint Paul (MN)

On-site

USD 90,000 - 130,000

Full time

14 days+
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Job summary

Optomec seeks an Aerosol Jet Applications Engineer to lead hands-on demonstrations of the AJ printing process and fabricate functional test parts for customers. You will work with the Advanced Applications team to evaluate customer requests and develop demonstrations based on AJ capabilities and available materials.

The role involves collaborating with product engineers and scientists on long-term R&D projects across areas such as printed antennas, semiconductor packaging, and embedded sensors.

Qualifications

  • Ideal candidate has B.S. in physical sciences or engineering and 3–5 years of experience, with advanced degree preferred.
  • Knowledge of electronics manufacturing, materials, processes and technology.
  • Strong communication skills for proposals, reports, and presentations.

Responsibilities

  • Lead hands-on demonstrations of the AJ printing process and fabricate test parts.
  • Evaluate customer requirements and develop demonstrations based on AJ capabilities.
  • Collaborate with product engineers and scientists on long-term R&D projects.
  • Travel up to 20% domestically or internationally to customer and vendor sites.

Skills

Electronics manufacturing knowledge
Strong communication
Proposal and technical report writing

Education

BS in physical sciences or engineering
MS or PhD in physical sciences or engineering

Tools

Cognex machine vision
Python
C++
MATLAB
LabVIEW
SOLIDWORKS

Job description

Optomec seeks an Aerosol Jet Applications Engineer to lead hands-on demonstrations of the AJ printing process and fabricate functional test parts for customers. You will work with the Advanced Applications team to evaluate customer requests and develop demonstrations based on AJ capabilities and available materials.

The role involves collaborating with product engineers and scientists on long-term R&D projects across areas such as printed antennas, semiconductor packaging, and embedded sensors.

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