Advanced Packaging Integration Engineer (Hybrid/Remote)

Lam Research Corporation; Tualatin (OR); Hybrid; USD 160,000 - 210,000; Full time

Job summary

Lam Research Corporation seeks a senior expert to lead advanced packaging integration initiatives, spanning 2D/2.5D/3D, WLP, and HBM. You will translate customer roadmaps into viable test vehicles and process flows, coordinating across engineering, manufacturing, and ecosystem teams for high-yield, reliable solutions.

You will partner with executives to steer strategy, manage cross-functional programs, and push for innovations that keep Lam at the forefront of technology.

Qualifications

• Master's or PhD in Engineering or related discipline.
• 10+ years of experience in semiconductor process development, packaging integration (TSV, WLP, HB, panel level packaging), model-based problem solving, program management, or related functions.
• Strong fundamental understanding of advanced packaging technologies and integration, industry direction, and research initiatives.
• Proficiency in statistical data analysis, process controls, optimization, and utilizing AI tools for efficiency.
• Excellent communication and problem-solving skills with the ability to collaborate extensively within and outside Lam Research.
• Demonstrated experience partnering with senior executives and business stakeholders to define strategy, prioritize investments, and deliver business outcomes.

Responsibilities

• Provide subject matter expertise in logic and memory advanced packaging integration (2D/2.5D/3D, WLP, HBM).
• Synthesize customer roadmap needs, generate flow options, identify unit process challenges, and propose solutions for maximum performance and reliability.
• Collaborate with PG engineering and customer account teams on test vehicle needs and development flows.
• Study system-level co-optimization trends across logic/memory segments to identify HW and process needs.
• Design experiments, lead data analysis, and drive root-cause + corrective actions.
• Define JDP scope, objectives, KPIs, and milestones with ecosystem leads and program managers.
• Lead collaborations with peers/partners/startups to implement co-optimized integration strategies.
• Drive JDPs with materials suppliers and metrology companies for co-development.
• Stay updated on advanced packaging research and assist product marketing with market assessments.
• Support customer engagement meetings and represent Lam at industry conferences.

Skills

Advanced packaging integration

2D/2.5D/3D packaging

WLP

HBM

Statistical data analysis

Process controls

AI tools for efficiency

Cross-functional collaboration

Program management

Communication skills

Education

Master's or PhD in Engineering or related discipline

Tools

JMP

Minitab

Design of Experiments (DOE) tools

Job description

Lam Research Corporation seeks a senior expert to lead advanced packaging integration initiatives, spanning 2D/2.5D/3D, WLP, and HBM. You will translate customer roadmaps into viable test vehicles and process flows, coordinating across engineering, manufacturing, and ecosystem teams for high-yield, reliable solutions.

You will partner with executives to steer strategy, manage cross-functional programs, and push for innovations that keep Lam at the forefront of technology.