Process Engineer 5 (Advanced Packaging Integration Technologist)

Lam Research; Tualatin (OR); On-site; USD 140,000 - 210,000; Full time

Benefits offered by this job

On-site Flex

Virtual Flex

Job summary

Lam Research in Tualatin, OR seeks a Process Engineer 5 to lead advanced packaging integration programs and drive measurable value across engineering, manufacturing, and supply chain.

You will collaborate with multiple product groups and ecosystem partners, defining scope, milestones, and success metrics for complex JDPs and research initiatives.

Qualifications

• Master's or PhD in Engineering (electrical/mechanical/chemical), Materials Science, Applied Physics, Chemistry, or related discipline.
• 10+ years of experience in semiconductor process development, packaging integration, or related business functions within a complex enterprise.
• Strong fundamental understanding of advanced packaging technologies and integration, industry direction, and research initiatives.
• Proficiency in statistical data analysis, process controls, optimization, and utilizing AI tools for efficiency.
• Excellent communication and problem-solving skills with the ability to collaborate extensively within and outside Lam Research.
• Demonstrated experience partnering with senior executives and business stakeholders to define strategy, prioritize investments, and deliver business outcomes.
• Experience managing cross-functional programs and influencing stakeholders in a global, matrixed organization.

Responsibilities

• Provide subject matter expertise in logic and memory advanced packaging integration (2D/2.5D/3D, WLP, HBM, etc.).
• Synthesize roadmap needs, identify unit challenges, and propose solutions for top product performance and reliability.
• Collaborate with PG engineering and customer accounts on test vehicle needs and flows.
• Study system-level co-optimization across logic and memory segments to identify HW and process needs.
• Design experiments, lead data analysis, and drive root-cause analysis and corrective actions.
• Define JDP scope, objectives, KPIs, milestones with ecosystem leads and program managers.
• Lead collaborations with peers/partners/startups for co-optimized integration strategies.
• Coordinate with suppliers and metrology companies for co-development opportunities.
• Stay current on advanced packaging research and assist marketing with market assessments.

Skills

Advanced packaging knowledge

Statistical analysis

Process controls

Optimization

AI tools

Communication

Problem solving

Cross-functional leadership

Stakeholder influence

Education

Master's or PhD in Engineering (electrical/mechanical/chemical) or related discipline

Tools

JMP

Minitab

Job description

In your career, let’s prove what’s possible.

At Lam Research, we create equipmentthat drives technological advancements in the semiconductor industry. Our innovative solutions enable chipmakers to power progress in nearly all aspects of modern life, and it takes each member of our team to make it possible.
Across our organization, our employees come to work and change the world. We take on the toughest challenges with precision and accuracy. We push for the next big semiconductor breakthrough. We lead the way in one of the most critical and fast-moving industries on the planet. And we do it together, with deep connections and limitless collaboration.
The impact we have on the world is made possible by focusing on our people. So we recognize and celebrate our teams’ achievements. We strive to create an inclusive and diverse culture where everyone’s contribution and voice has value. We evaluate and evolve our offerings, so our people receive the support and empowerment to do meaningful things for their lives, careers, and communities.
Because at Lam, we believe that when people are the priority and they’re inspired to unleash the power of innovation for a better world together, anything is possible.

Process Engineer 5 (Advanced Packaging Integration Technologist)

Date: Oct 15, 2026

Location: Tualatin, OR, US, 97062

Worker Category: On-site Flex

The group you’ll be a part of

The Advanced Packaging Integration Group focuses on driving differentiated solutions from Lam to enable customer heterogeneous integration product and process roadmaps through orchestration of joint projects and integrated test vehicles with ecosystem partners including research institutes, consortia, universities, and peer companies. The Technology and Ecosystem Engagements Group enables a virtual integration center for Lam product groups and customer engagement teams to drive accelerated studies to understand and resolve challenging process integration problems and deliver unique and effective product solutions to meet future customer roadmaps.

The impact you’ll make

In this role, you will directly contribute to expanding Lam Research's Advanced Packaging technology leadership and industry influence by leading and executing complex JDPs and research programs that create measurable business value across engineering, manufacturing, supply chain, and business operations. You will partner with engineers and leaders across multiple product groups and customer account teams across Lam as well as external ecosystem leaders to orchestrate a virtual integration center that enables faster decision-making, operational efficiency, innovation, and strengthens Lam's competitive advantage. You will collaborate and generate integration flows that meet manufacturability and reliability requirements to drive novel technology development options. You will also represent Lam Research as a technology ambassador at industry conferences and symposiums, enhancing our vision and strategy of advancing technology through strong ecosystem collaborations.

What you’ll do

• Subject matter expertise in logic and memory advanced packaging integration including 2D/2.5D/3D, WLP, HBM, etc.
• Ability to synthesize customer AP roadmap needs, generate process integration flow options, identify unit process challenges, and propose solution paths to enable highest possible product performance, yield, and reliability.
• Engage closely with PG engineering and customer account technologist teams on test vehicle needs for improved unit process development and characterization, help develop test vehicle flows.
• Study system-level co-optimization trends across different logic and memory product and process segments, identify emerging challenges and critical HW and process needs that Lam products need to develop to stay differentiated and ahead of competition.
• Design experiments, lead data analysis, and drive systematic root-cause + corrective actions as needed to resolve process integration problems.
• Along with ecosystem engagement lead and program managers, develop clear JDP scope, objectives, KPIs/success metrics, and milestones.
• Engage and lead collaborations with peers/partners/startups to define, execute, and implement co-optimized integration strategies and solutions.
• Drive JDPs with materials suppliers and metrology companies to realize and enable new avenues for co-development and characterization.
• Stay up to date on advanced packaging research, pathfinding, and innovations and assist product marketing leaders in market assessments, competitive intelligence reports, strategic initiatives, and portfolio gap analysis.
• Support customer engagement meetings and escalations related to integrated problems.
• Represent Lam at industry conferences and symposiums to expand network, influence, and branding.
• Support mentoring and recruitment for the ecosystem team.

Who we’re looking for

• Master's or PhD in Engineering (electrical/mechanical/chemical), Materials Science, Applied Physics, Chemistry, or a related discipline.
• 10+ years of experience in semiconductor process development, packaging integration (TSV, WLP, HB, panel level packaging etc.), model-based problem solving, program management, or related business functions within a complex enterprise environment.
• Strong fundamental understanding of advanced packaging technologies and integration, industry direction, and research initiatives.
• Proficiency in statistical data analysis, process controls, optimization, and utilizing AI tools for efficiency.
• Excellent communication and problem-solving skills with the ability to collaborate extensively within and outside Lam Research.
• Demonstrated experience partnering with senior executives and business stakeholders to define strategy, prioritize investments, and deliver business outcomes.
• Experience managing cross-functional programs and influencing stakeholders in a global, matrixed organization.

Preferred qualifications

• Experience with initiation, definition, and execution of joint development projects with research institutes, industry consortia, and academic institutions.
• Semiconductor, capital equipment, industrial technology, or advanced manufacturing industry experience.
• Strong network across the industry ecosystem and research communities.
• Highly effective in ambiguous situations, capable of making high-impact decisions with incomplete data to ensure programs stay on track and on schedule.
• Familiarity with working in a laboratory and on semiconductor equipment with experience in surface preparation and analytical techniques.
• In-depth understanding of Statistical Process Control (SPC) and/or Design of Experiments (DOE).
• Working knowledge of statistical analysis and problem-solving methodologies.
• Experience with statistical tools (JMP, Minitab, etc.).
• Background in Atomic Layer Deposition (ALD), Chemical Vapor Deposition (CVD), Plasma-Enhanced Chemical Vapor Deposition (PECVD), or Physical Vapor Deposition (PVD).
• Background in Plasma Physics, Reactive Ion Etching (RIE), Atomic Layer Etching (ALE), Inductively Coupled Plasma (ICP), Capacitively Coupled Plasma (CCP).
• Knowledge of material synthesis and material characterization.
• Experience working in a collaborative and matrixed environment with diverse teams, semiconductor customers, and/or partners.
• Experience in semiconductor, process design, deposition, etch dielectrics or conductor, metal films, etc.

Our commitment

We believe it is important for every person to feel valued, included, and empowered to achieve their full potential. By bringing unique individuals and viewpoints together, we achieve extraordinary results.

Lam Research ("Lam" or the "Company") is an equal opportunity employer. Lam is committed to and reaffirms support of equal opportunity in employment and non-discrimination in employment policies, practices and procedures on the basis of race, religious creed, color, national origin, ancestry, physical disability, mental disability, medical condition, genetic information, marital status, sex (including pregnancy, childbirth and related medical conditions), gender, gender identity, gender expression, age, sexual orientation, or military and veteran status or any other category protected by applicable federal, state, or local laws. It is the Company's intention to comply with all applicable laws and regulations. Company policy prohibits unlawful discrimination against applicants or employees.

Lam offers a variety of work location models based on the needs of each role. Our hybrid roles combine the benefits of on-site collaboration with colleagues and the flexibility to work remotely and fall into two categories – On-site Flex and Virtual Flex. ‘On-site Flex’ you’ll work 3+ days per week on-site at a Lam or customer/supplier location, with the opportunity to work remotely for the balance of the week. ‘Virtual Flex’ you’ll work 1-2 days per week on-site at a Lam or customer/supplier location, and remotely the rest of the time.

Our Perks and Benefits

At Lam, our people make amazing things possible. That’s why we invest in you throughout the phases of your life with a comprehensive set of outstanding benefits.

Nearest Major Market: Portland Oregon
Job Segment: Chemical Research, Process Engineer, Supply Chain, Manufacturing Engineer, Engineering, Operations, Research