3D IC Applications Engineer — Flexible Work & Global Travel

Siemens EDA (Siemens Digital Industries Software); Fremont (CA); Hybrid; USD 120,000 - 180,000; Full time

Job summary

Siemens EDA (Siemens Digital Industries Software) is seeking an Applications engineer to support consultative sales with technical wins using Innovator 3D IC Layout and related tools. You will present, demonstrate, and benchmark products, while helping architect 3DIC solution flows and integration scripts for key accounts across the US.

International travel may be required. The role requires MSEE/BSEE with 4+ years in IC package/interposer design, strong scripting ability, and familiarity with

Qualifications

• MSEE/BSEE with 4+ years design experience.
• Experience in IC Package Design (Cadence APD/SiP, Siemens Xpedition/i3DL).
• Package design tools experience from setup to manufacturing docs.
• Familiarity with Package/Interposer planning solutions (XSI/i3DI, OrbitIO/ISP, 3DIC Compiler, Excel).
• 2.5D/3D chiplet design knowledge (TSMC InFO, CoWoS, EMIB, etc.).
• Knowledge of IC data formats (Verilog, LEF/DEF, GDS, OASIS).
• Signal/power integrity tools knowledge (HyperLynx, Sigrity, SIWave, ADS).
• Calibre DRC/LVS experience is valuable; MS Office & scripting basics.
• Windows and Linux OS familiarity; prior Applications Engineer experience preferred.

Responsibilities

• Deliver technical presentations and product demonstrations.
• Benchmark, prototype and develop flows integrating Siemens tools with customers.
• Develop solutions and account strategies to drive market share gains.
• Assist in architecting 3DIC flows and integration scripts.
• Travel domestically and internationally as needed.

Skills

IC Package Design

Package Design Tools

IC Data Formats

3DIC / 2.5D Design

Scripting / Programming

Calibre DRC/LVS

Windows and Linux OS

Applications Engineer experience

Education

MSEE/BSEE

Tools

Xpedition/i3DL

XSI/i3DI

OrbitIO/ISP

3DIC Compiler

Excel

Job description

Siemens EDA (Siemens Digital Industries Software) is seeking an Applications engineer to support consultative sales with technical wins using Innovator 3D IC Layout and related tools. You will present, demonstrate, and benchmark products, while helping architect 3DIC solution flows and integration scripts for key accounts across the US.

International travel may be required. The role requires MSEE/BSEE with 4+ years in IC package/interposer design, strong scripting ability, and familiarity with