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Design jobs in United States

Engineering Execution Manager, HIG High Bandwidth Memory (HBM)

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.

Singapour
Sur place
SGD 80 000 - 100 000
Il y a 13 jours
Je veux recevoir les dernières offres d’emploi de Design

Business Development for Interior Design

SANIQUO PTE. LTD.

Serangoon Garden Circus
Sur place
SGD 40 000 - 60 000
Il y a 13 jours

Full Stack Engineer

TOTAL EBIZ SOLUTIONS PTE. LTD.

Singapour
Sur place
SGD 60 000 - 80 000
Il y a 13 jours

Senior Principal Piping Stress Engineer

KELLOGG BROWN & ROOT ASIA PACIFIC PTE. LTD.

Singapour
Sur place
SGD 90 000 - 130 000
Il y a 13 jours

Staff RTL Engineer

AMBIQ MICRO SINGAPORE PRIVATE LTD.

Singapour
Sur place
SGD 80 000 - 100 000
Il y a 13 jours
discover more jobs illustrationDécouvrez plus d’offres que n’importe où ailleurs. Trouvez plus de postes maintenant

Architectural Design Coordinator (Main Contractor)

TALENT TRADER GROUP PTE. LTD.

Singapour
Sur place
SGD 50 000 - 75 000
Il y a 13 jours

3D Motion Graphics Designer – Creative Studio

Melior

Singapour
Sur place
SGD 45 000 - 65 000
Il y a 13 jours

Senior Corporate Interior Designer & Project Lead

ID21 PTE. LTD.

Singapour
Sur place
SGD 60 000 - 80 000
Il y a 13 jours
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Founding Mechanical Design Engineer – Robotics Startup

Second Talent

Singapour
Sur place
SGD 60 000 - 80 000
Il y a 13 jours

Low code Developer

TOTAL EBIZ SOLUTIONS PTE. LTD.

Singapour
Sur place
SGD 50 000 - 80 000
Il y a 13 jours

Industrial Automation & Electrical Controls Engineer

THE SUPREME HR ADVISORY PTE. LTD.

Singapour
Sur place
SGD 80 000 - 100 000
Il y a 13 jours

Senior Backend Engineer

SCREENING EAGLE SINGAPORE PTE. LTD.

Singapour
Sur place
SGD 70 000 - 100 000
Il y a 13 jours

Senior Software Engineer, Backend

AIRWALLEX (SINGAPORE) PTE. LTD.

Singapour
Sur place
SGD 80 000 - 120 000
Il y a 13 jours

Software Engineer (ReactJS Focused)

NICOLL CURTIN TECHNOLOGY PTE. LTD.

Singapour
Sur place
SGD 80 000 - 100 000
Il y a 13 jours

3D Interior Designer & Visualization Specialist

ENSEMBLE PTE. LTD.

Singapour
Sur place
SGD 40 000 - 60 000
Il y a 13 jours

[L1.5] Network Engineer | Contract

EVO OUTSOURCING SOLUTIONS PTE. LTD.

Singapour
Sur place
SGD 80 000 - 100 000
Il y a 13 jours

Head of Video (DTC : UGC, Reels, Testimonials, VSLs)

Maneuver Marketing

Singapour
Sur place
SGD 80 000 - 120 000
Il y a 13 jours

Senior IT Security Engineer

THALES SOLUTIONS ASIA PTE. LTD.

Singapour
Sur place
SGD 70 000 - 90 000
Il y a 13 jours

Senior Engineer, Manufacturing Quality Assurance

Edwards Lifesciences (Singapore) Pte Ltd

Singapour
Sur place
SGD 60 000 - 80 000
Il y a 13 jours

Senior Commercial Office Interior Designer

MGROUP GLOBAL DESIGN PTE. LTD.

Singapour
Sur place
SGD 50 000 - 70 000
Il y a 13 jours

Senior Optomechanical Engineer – Quantum Sensors (SRTT-Q.InC)

A*STAR RESEARCH ENTITIES

Singapour
Sur place
SGD 80 000 - 110 000
Il y a 13 jours

Senior Project Engineer (APAC) - Automation Instruments

Flintex Consulting Pte Ltd

Singapour
Sur place
SGD 80 000 - 100 000
Il y a 13 jours

Trend-Driven Fashion Designer: From Concept to Sourcing

JF Retail Pte Ltd

Singapour
Sur place
SGD 45 000 - 65 000
Il y a 13 jours

Interior Design Lead - Commercial & Hospitality Projects

THE SUPREME HR ADVISORY PTE. LTD.

Singapour
Sur place
SGD 60 000 - 80 000
Il y a 13 jours

Java Developer

MORGAN MCKINLEY PTE. LTD.

Singapour
Sur place
SGD 70 000 - 90 000
Il y a 13 jours
Engineering Execution Manager, HIG High Bandwidth Memory (HBM)
MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.
Singapour
Sur place
SGD 80 000 - 100 000
Plein temps
Il y a 13 jours

Résumé du poste

A leading technology company in Singapore is seeking an Engineering Execution Lead/Manager for the HBM HIG organization. This role involves guiding HBM products through various phases from concept to high-volume manufacturing, facilitating cross-functional lifecycle management. Candidates should possess a Bachelor's or Master's degree in Electrical or Computer Engineering, and have over 5 years of experience in technical or manufacturing settings. Excellent communication skills and familiarity with tools like JIRA and Confluence are essential. Competitive compensation is offered.

Qualifications

  • 5+ years of relevant technical or manufacturing experience.
  • Strong ability to lead cross-functional teams.
  • Excellent written and verbal communication skills.

Responsabilités

  • Integrate all aspects of HBM development within teams.
  • Partner with various teams to drive development progress.
  • Provide regular updates on development status and challenges.

Connaissances

Communication skills
Data analysis
Project Management

Formation

Bachelor’s or Master’s degree in Electrical or Computer Engineering

Outils

JIRA
Confluence
Description du poste

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

In HBM HIG (High Bandwidth Memory, DRAM Eng Group), we innovate and integrate end to end leading edge FE and BE process with state-of-the-art design, debug, test, and qualification techniques to develop the lowest power per bit solution to enhance customer experience in the field of ML (Machine Learning) and AI (Artificial Intelligence). The success of a complex product such as HBM relies vastly on the vertical integration and the various engineering working in unison.

As an Engineering Execution Lead/Manager in the HBM HIG organization you will be responsible for guiding a HBM product through various phases of a product i.e. concept, design, NPI and HVM by facilitating cross-functional life-cycle management. You will help build and maintain detailed development schedule and drive relevant tactical execution. In this position, you will provide leadership and direction for the Product Development Team (PDT) by defining and prioritizing projects, identifying, and analyzing issues and risk, and identifying resources to meet timelines and deliverables.

Key Responsibilities include, but are not limited to:
  • Integrate all aspects of HBM development within the extended HIG and TPG teams and with partner organizations.
  • Partner with the Technology Development, Design, Process, APTD, PE and Manufacturing teams to drive development progress and alignment.
  • Collaborate with PMO org to build and maintain detailed development schedule and drive relevant tactical execution starting from pre-silicon to all the way to HVM.
  • Provide regular communication of development status, priorities, and challenges across the broader organization.
  • Set and prioritize tactical expectations across development activities, according to defined milestones and stakeholder needs and expectations.
  • Serve as a point of contact for the product, including identifying owners for tasks and issues that require coverage and managing development documentation.
  • Consolidate and provide the inputs for hardware readiness and capacity planning required to support engineering activities.
Key Requirements
  • Bachelor’s or Master’s degree in Electrical or Computer Engineering or manufacturing/supply chain related fields.
  • 5+ years of relevant technical, manufacturing or experience in driving cross functional teams.
  • Excellent Communication/Presentation skills.
  • Excellent written and verbal communication skills for technical and senior management audiences.
  • Comfortable with data analysis methods and data visualization; communicating data-backed conclusions.
  • Familiarity and capability with JIRA, Confluence, Project Management software tools.
  • Having an innovative mindset which is open to improve upon any process or product.
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* Le salaire de référence se base sur les salaires cibles des leaders du marché dans leurs secteurs correspondants. Il vise à servir de guide pour aider les membres Premium à évaluer les postes vacants et contribuer aux négociations salariales. Le salaire de référence n’est pas fourni directement par l’entreprise et peut pourrait être beaucoup plus élevé ou plus bas.

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