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A leading technology company in Singapore is seeking an Engineering Execution Lead/Manager for the HBM HIG organization. This role involves guiding HBM products through various phases from concept to high-volume manufacturing, facilitating cross-functional lifecycle management. Candidates should possess a Bachelor's or Master's degree in Electrical or Computer Engineering, and have over 5 years of experience in technical or manufacturing settings. Excellent communication skills and familiarity with tools like JIRA and Confluence are essential. Competitive compensation is offered.
Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
In HBM HIG (High Bandwidth Memory, DRAM Eng Group), we innovate and integrate end to end leading edge FE and BE process with state-of-the-art design, debug, test, and qualification techniques to develop the lowest power per bit solution to enhance customer experience in the field of ML (Machine Learning) and AI (Artificial Intelligence). The success of a complex product such as HBM relies vastly on the vertical integration and the various engineering working in unison.
As an Engineering Execution Lead/Manager in the HBM HIG organization you will be responsible for guiding a HBM product through various phases of a product i.e. concept, design, NPI and HVM by facilitating cross-functional life-cycle management. You will help build and maintain detailed development schedule and drive relevant tactical execution. In this position, you will provide leadership and direction for the Product Development Team (PDT) by defining and prioritizing projects, identifying, and analyzing issues and risk, and identifying resources to meet timelines and deliverables.