Wire Bond Process Development Engineer | Quality Innovator

TALENT TRADER GROUP PTE. LTD.

Singapore

On-site

SGD 45,000 - 75,000

Full time

9 days ago

Get a reply from this employer

Your resume and cover letter, tailored to exactly what they’re hiring for.

Get past ATS filters

Job summary

TALENT TRADER GROUP PTE. LTD. is seeking a manufacturing professional to optimize wire bonding processes across gold, silver, and copper materials.

The role focuses on quality, stability, and performance improvements within a semiconductor assembly/testing environment. You will coordinate NPI/NPQ activities for new products and equipment, support material development, and help benchmark technology while maintaining and repairing essential production equipment.

Qualifications

  • Diploma or degree in Electronics Engineering or Materials Science.
  • At least 3 years of manufacturing experience, preferably in semiconductor assembly/testing.
  • Familiar with quality tools and standards: FMEA, SPC, DOE, ISO 9001/14001, JEDEC.
  • Strong analytical and problem-solving abilities with good communication.
  • Ability to multitask and work independently in a fast-paced environment.

Responsibilities

  • Ensure processes meet customer specifications and conduct failure analysis to identify root causes and implement corrective actions.
  • Develop and optimize wire bonding processes (gold, silver and copper) to improve quality, stability and performance.
  • Coordinate NPI, NPQ and qualification activities for new products, materials, devices and equipment.
  • Support new tape and material development, supplier qualification and technology benchmarking.
  • Maintain, troubleshoot and perform minor repairs on assembly and testing equipment.
  • Develop and update SOPs, train colleagues on new processes and equipment, and participate in internal and external audits.
  • Ensure compliance with company quality, environmental, health and safety requirements.

Skills

Analytical skills
Problem solving
Communication
Multitasking
Independent worker

Education

Diploma/Degree in Electronics Engineering or Materials Science

Tools

FMEA
SPC
DOE
ISO 9001
ISO 14001
JEDEC standards

Job description

TALENT TRADER GROUP PTE. LTD. is seeking a manufacturing professional to optimize wire bonding processes across gold, silver, and copper materials.

The role focuses on quality, stability, and performance improvements within a semiconductor assembly/testing environment. You will coordinate NPI/NPQ activities for new products and equipment, support material development, and help benchmark technology while maintaining and repairing essential production equipment.

Get your free, confidential resume review.

or drag and drop your file here.

Similar jobs

Similar jobs worth comparing

Process Development Engineer (Wire Bond)
Process Development Engineer (Wire Bond)

TALENT TRADER GROUP PTE. LTD. • Singapore

On-site
SGD 45,000 - 75,000
Bonding Wire Process Engineer: Continuous Improvement
Bonding Wire Process Engineer: Continuous Improvement

HERAEUS MATERIALS SINGAPORE PTE. LTD. • Singapore

On-site
SGD 60,000 - 90,000
Process Engineer
Process Engineer

HERAEUS MATERIALS SINGAPORE PTE. LTD. • Singapore

On-site
SGD 60,000 - 90,000
Wire Bond Equipment Engineer - Hands-On, 12h Rotating Shifts
Wire Bond Equipment Engineer - Hands-On, 12h Rotating Shifts

PEOPLE PROFILERS PTE. LTD. • Singapore

On-site
SGD 32,000 - 42,000
Wire Bond Technician / Operator
Wire Bond Technician / Operator

ACCTON TECHNOLOGY SG PTE. LTD. • Singapore

On-site
SGD 28,000 - 39,000
Restaurant d'entreprise
Indemnités de stage/alternance
Process Engineer: Die Bonding & Precision Automation
Process Engineer: Die Bonding & Precision Automation

TALENT RECRUITMENT PTE. LTD. • Singapore

On-site
SGD 45,000 - 67,000
Wire Bond Equipment Engineer – Hands-on, 12-hour Shifts
Wire Bond Equipment Engineer – Hands-on, 12-hour Shifts

STATS CHIPPAC MANAGEMENT PTE. LTD. • Singapore

On-site
SGD 28,000 - 45,000
Wire Bond-Manufacturing Engineer
Wire Bond-Manufacturing Engineer

Lumilens • Singapore

On-site
SGD 70,000 - 110,000
Competitive salary and benefits
Cutting-edge packaging technology
Collaborative engineering environment
+1
Associate Engineer – Wire Bond Equipment
Associate Engineer – Wire Bond Equipment

PEOPLE PROFILERS PTE. LTD. • Singapore

On-site
SGD 32,000 - 42,000
Wire Bond Equipment Engineer - 2+ yrs, 12-Hr Shifts
Wire Bond Equipment Engineer - 2+ yrs, 12-Hr Shifts

Wanco Manpower Pte Ltd • Singapore

On-site
SGD 48,000 - 66,000