Bonding Wire Process Engineer: Continuous Improvement

HERAEUS MATERIALS SINGAPORE PTE. LTD.

Singapore

Presencial

SGD 60.000 - 90.000

Jornada completa

14 días+

Una candidatura completa en un minuto

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Descripción de la vacante

Heraeus Materials Singapore Pte. Ltd. is seeking a Process Engineer to sustain and optimize bonding wire manufacturing, troubleshoot production issues, and drive continuous improvements in yield, productivity, quality, and cost competitiveness.

You will collaborate with Manufacturing, Maintenance, NPI, and Quality Assurance to update FMEA, Control Plans, and SOP documentation, monitor SPC/SQC metrics, and contribute to Industry 4.0 initiatives and new product introductions.

Formación

  • Bachelor degree in engineering (Mechanical/Chemical/Electrical & Electronics/Physics) or related field.
  • 2 years of relevant experience preferred.
  • Knowledge of semiconductor interconnect and bonding wire materials preferred.
  • Strong troubleshooting and problem-solving skills.
  • Familiarity with SPC/DOE/6 Sigma concepts is advantageous.

Responsabilidades

  • Lead or participate in process improvement projects for bonding wire manufacturing.
  • Evaluate new machines, materials, and processes.
  • Troubleshoot production issues and monitor key process variables.
  • Collaborate with cross-functional teams to update FMEA, Control Plans, and SOPs.

Conocimientos

Troubleshooting
Process optimization
Cross-functional teamwork
Quality & problem solving

Educación

Bachelor of Engineering (Mechanical/Chemical/E&E/Physics)

Herramientas

SPC
Minitab
JMP

Descripción del empleo

Heraeus Materials Singapore Pte. Ltd. is seeking a Process Engineer to sustain and optimize bonding wire manufacturing, troubleshoot production issues, and drive continuous improvements in yield, productivity, quality, and cost competitiveness.

You will collaborate with Manufacturing, Maintenance, NPI, and Quality Assurance to update FMEA, Control Plans, and SOP documentation, monitor SPC/SQC metrics, and contribute to Industry 4.0 initiatives and new product introductions.

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