Process Development Engineer (Wire Bond)

TALENT TRADER GROUP PTE. LTD.; Singapore; On-site; SGD 45,000 - 75,000; Full time

Job summary

TALENT TRADER GROUP PTE. LTD. is seeking a manufacturing professional to optimize wire bonding processes across gold, silver, and copper materials.

The role focuses on quality, stability, and performance improvements within a semiconductor assembly/testing environment. You will coordinate NPI/NPQ activities for new products and equipment, support material development, and help benchmark technology while maintaining and repairing essential production equipment.

Qualifications

• Diploma or degree in Electronics Engineering or Materials Science.
• At least 3 years of manufacturing experience, preferably in semiconductor assembly/testing.
• Familiar with quality tools and standards: FMEA, SPC, DOE, ISO 9001/14001, JEDEC.
• Strong analytical and problem-solving abilities with good communication.
• Ability to multitask and work independently in a fast-paced environment.

Responsibilities

• Ensure processes meet customer specifications and conduct failure analysis to identify root causes and implement corrective actions.
• Develop and optimize wire bonding processes (gold, silver and copper) to improve quality, stability and performance.
• Coordinate NPI, NPQ and qualification activities for new products, materials, devices and equipment.
• Support new tape and material development, supplier qualification and technology benchmarking.
• Maintain, troubleshoot and perform minor repairs on assembly and testing equipment.
• Develop and update SOPs, train colleagues on new processes and equipment, and participate in internal and external audits.
• Ensure compliance with company quality, environmental, health and safety requirements.

Skills

Analytical skills

Problem solving

Communication

Multitasking

Independent worker

Education

Diploma/Degree in Electronics Engineering or Materials Science

Tools

FMEA

SPC

DOE

ISO 9001

ISO 14001

JEDEC standards

Job description

Responsibilities

• Ensure processes meet customer specifications and conduct failure analysis to identify root causes and implement corrective actions.
• Develop and optimize gold, silver and copper wire bonding processes to improve quality, stability and performance.
• Coordinate NPI, NPQ and qualification activities for new products, materials, devices and equipment.
• Support new tape and material development, supplier qualification and technology benchmarking.
• Maintain, troubleshoot and perform minor repairs on assembly and testing equipment.
• Develop and update SOPs, train colleagues on new processes and equipment, and participate in internal and external audits.
• Ensure compliance with company quality, environmental, health and safety requirements.

Requirements

• Diploma or Degree in Electronics Engineering or Materials Science.
• Minimum 3 years of manufacturing experience, preferably in semiconductor assembly and testing.
• Familiarity with FMEA, SPC, OCAP, DOE, ISO 9001, ISO 14001, QEMS, CQM and JEDEC standards.
• Strong analytical, problem-solving and communication skills, with the ability to multitask and work independently in a fast-paced environment.
• Knowledge of bonding wire materials, encapsulants, substrates and IC assembly processes, including die attach, wire bonding, encapsulation and testing.
• Experience in maintaining assembly and testing equipment.

EA License No: 13C6305 Reg. No.: R1985234 (GOH HOOI MING)