Wire Bond Equipment Engineer – Hands-on, 12-hour Shifts

STATS CHIPPAC MANAGEMENT PTE. LTD.

Singapore

On-site

SGD 28,000 - 45,000

Full time

9 days ago

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Job summary

STATS ChipPAC MANAGEMENT PTE. LTD. is seeking a motivated Associate Engineer to support the setup, maintenance, troubleshooting, and repair of wire bond equipment in a semiconductor manufacturing environment.

You will perform machine setup, qualification, and conversion for wire bond equipment, troubleshoot issues to minimize downtime, and conduct preventive and corrective maintenance. The role requires 12-hour rotating shifts, including day and night coverage, reflecting demanding production

Qualifications

Diploma in Electrical, Electronics, Mechanical or Mechatronics is required.
2+ years hands-on experience with wire bond equipment maintenance and troubleshooting.
Experience with KNS Maxum, iConn, or Rapid Bonder is preferred.
Candidate should be able to support 12-hour rotating shifts.

Responsibilities

Perform machine setup, qualification, and conversion for wire bond equipment.
Troubleshoot and repair equipment-related issues to minimize production downtime.
Conduct preventive and corrective maintenance activities.
Monitor equipment performance and implement improvement actions.
Support production during machine breakdowns and urgent technical issues.
Perform root cause analysis and corrective actions.
Maintain equipment documentation and spare parts records.