Associate Engineer / Engineer (Thin Film)

Silicon Box Inc; Singapore; On-site; SGD 48,000 - 80,000; Full time

Job summary

Silicon Box Inc is seeking a Process Engineer to develop and establish production thin film processes. You will help transfer pilot line processes to production and drive process capability and control across the line.

The role requires a Bachelor's degree in Chemical, Materials Science, Microelectronics, Mechanical Engineering or related field, with at least 3 years’ hands-on experience in Wafer-level FO packaging or LCD/FPD production (PVD).

Qualifications

• Bachelor’s degree in a relevant engineering field.
• Hands-on process experience in Wafer-level Fanout packaging or LCD/FPD production (PVD).
• Knowledge of process engineering, process control engineering and yield optimization.

Responsibilities

• Review and accept machine buyoff, set up pilot line process and transfer to production line.
• Establish, review and update specifications, workflow, quality and safety documentation.
• Troubleshoot process issues and improve capabilities, yield and cycle time.
• Lead SPC control towards zero defects; review FMEA and Control Plans with cross-functional teams.
• Coordinate with vendors on process or quality issues; support customer NPI activities.

Skills

Process engineering

Process control engineering

Yield enhancement

SPC

DOE

8D reports

Education

Bachelor's Degree in Chemical, Materials Science, Microelectronics, Mechanical Engineering or relevant engineering degrees

Job description

Process Engineer is responsible for development and establishment of production thin film process.

Key Responsibilities

• Review and accept machine buyoff, setup pilot line process and transfer from pilot line to production line.


• Establish, review and update specifications, workflow, quality and safety related documentation for production line.


• Troubleshoot process issue and improve process capabilities, yield and cycle time from customer NPI stage to LVM/HVM stage.


• Process sustaining and control through SPC and periodic defect Pareto Analysis.


• Lead and drive SPC control towards zero defects. Review and update FMEA, Control plan OCAP with cross-functional teams.


• Coordinate and liaise with vendor/suppliers on process issue or quality issue.


• Support customer NPI activities and internal engineering activities.


• New material, process & machine development and qualification.


• Handle and manage customer audits and 8D reports.


• Provide disposition for engineering and production lots.


• Conduct process characterization and qualification to establish process baseline.


• Any other ad-hoc duties as assigned.

Requirements

• Bachelor's Degree in Chemical, Materials Science, Microelectronics, Mechanical Engineering or relevant engineering degrees.


• At least 3-years hands-on process experience in area of in the Wafer-level Fanout packaging production line or LCD/FPD production line in PVD


• Knowledge in process engineering, process control engineering and yield enhancement.


• Experience in SPC, DOE, FEMA, and 8D reports