Staff Product Engineer

QORVO INTERNATIONAL PTE. LTD.; Singapore; On-site; SGD 90,000 - 130,000; Full time

Job summary

QORVO INTERNATIONAL PTE. LTD. is seeking an OSAT Staff/Senior PE to drive NPI-to-HVM execution, focusing on test yield, quality, and productivity improvements.

You will own product behavior, test results and reliability, coordinating with Design, Fab Foundries, OSATs, and Business Units to ensure manufacturability and readiness for high-volume production. The role emphasizes data analytics, cross-functional collaboration, and engineering-based decisions that impact product release, yield

Qualifications

• Bachelor’s degree in Electronic/Electrical Engineering with 8+ years semiconductor industry experience.
• Experience with RF communication systems and RF front end component technologies.
• Willingness to travel APAC wide and work extra hours as required.
• Proficient in data analytics and English communication; ability to articulate problems clearly.
• Lean Manufacturing, PDCA, DMAIC knowledge and POR/POA execution.
• Experience using JMP, Spotfire, Power BI, Data Science, AI/AGI tools for analytics and productivity.

Responsibilities

• Drive NPI→HVM ramp and execution excellence.
• Improve test yield, quality and reliability through data-driven analysis.
• Collaborate with Design, Product Engineering, Fab Foundries, Test Engineering, and Equipment teams to close yield and quality gaps.
• Ensure manufacturing readiness and risk mitigation for PDE gate execution.
• Lead test program verification, correlation and release with Test and Application Engineering.
• Align test strategy and platform roadmap across Business Units and regions.

Skills

Data analytics

Communication

Problem articulation

Lean manufacturing

PDCA

Cross-functional collaboration

Education

Bachelor’s degree in Electronic/Electrical Engineering

Tools

JMP

Spotfire

Power BI

Data Science

AI/AGI tools

Job description

Role Summary:

OSAT Staff/ Senior PE responsible for driving assigned products NPI-to-HVM execution including test yield, quality, and productivity improvements, while ensuring alignment across Product Engineering, Test Engineering, Design, Fab Foundries, OSATs, and Business Units. It is a highly technical role responsible for product ownership across multiple Outsourced Assembly and Test sites. This role requires deep semiconductor product, test, yield, quality, and data analytics expertise to resolve complex product-specific issues from NPI through HVM, while making engineering-based decisions that directly affect product release, yield recovery, quality containment, customer risk, cost, and manufacturing continuity. OSAT PE translate product behavior, test results, yield signals, reliability indicators, and OSAT execution constraints into actionable engineering direction, ensuring that products are manufacturable, testable, reliable, cost-effective, and ready for sustained high-volume production.

Responsibilities / Accountabilities

NPI→HVM Ramp & Execution Excellence

• Ensure smooth ramp ofNew Product Introduction (NPI) intoHigh Volume Manufacturing (HVM) for assigned products
• Drive rapid issue resolution relatedto product yield, test coverage, quality escapes, test time reduction, and cost optimizationthrough disciplined cross-functional collaboration.
• Ensure manufacturing readiness, risk mitigation, and adherence to Product DevelopmentPDE gate execution models.

Test Yield, Quality & Reliability Improvement

• Drive test yield performance management, including yield trend monitoring, Pareto analysis, systematic yield dip diagnosis, and gap closure.
• Drivestatistical analysis (SPC, GR&R, Cp/Cpk), quality & ESD complianceand data-driven root cause investigations across wafer probe and final test.
• Collaborate closely withDesign, Product Engineering, Fab Foundries, Test Engineering, andEquipment teamsto close yield and quality gaps against business targets.

Quality Monitoring and Problematic Lot Disposition Leadership

• Investigation and disposition ofproblematic materials, including on-hold wafer lots and package test failures.
• Perform deep-divefailure analysis, parametric correlation, and historical trend analysisto ensure timely and quality-compliant decisions.

Test Program Verification, Correlation & Release

• Collaborate withTest Engineering and Application Engineeringon test program development, verification, correlation, validation, and release.
• Ensure alignment betweenbench, characterization, ATE, probe, and final testresults before production release.
• Driverobust guard-banding, limits optimization, and test coverage integrityto prevent test escapee.

Global Stakeholder Alignment & Strategy Deployment

• Maintain strong collaboration withBusiness Unit PDE/TDE, Global Advance Test Engineering (GATE), Application Engineering, and Manufacturing Operations.
• Ensure alignment ontest strategy, platform roadmap, cost, capacity, and deployment plansacross regions.

Learning Development & Continuous Improvement

• Build, Manage, Drive PE competencywith continuous leaning development of new skills or new technology and adhere continuous improvement & Lean culture, PDCA with Plan of Record (POR) & Plan of Action (POA).

Requirements:

• Bachelor’s degree in Electronic/Electrical Engineering with a minimum of 8 years of semiconductor industry related experience
• Understanding RF communication systems and RF front end component technologies. Experience working on test equipment such as ATE RF tester, handler or probers and application lab bench tools
• Committed individual who is willing to travel APAC wide and put in extra hours as required on business needs
• Good inData Analytics, communication skillsin English andproblem articulation
• Experienced in Lean Manufacturing, PDCA, DMAIC knowledge and POR, POA execution
• Experienced in using JMP, Spotfire, Power BI, Data Science, AI/AGI tools in data analytics and productivity improvement