Senior/Staff Quality Assurance Engineer or Manager (OSAT)

Lumilens; Singapore; On-site; SGD 90,000 - 140,000; Full time

Job summary

Lumilens in Singapore seeks a Senior Quality Engineer to design, monitor and maintain quality standards for semiconductor assembly and test processes.

The role emphasizes documentation, SPC, PFMEA, CAPA, and collaboration with OSAT partners to ensure ISO 9001 and IATF 16949 compliance. Strong analytical and communication skills are essential.

Qualifications

• Bachelor's degree in a relevant engineering field.
• At least 5 years in semiconductor QA for OSAT or IDMs.
• Experience with semiconductor packaging technologies such as Flip Chip, BGA, QFN, WLCSP.
• Knowledge of quality tools and ISO/IATF standards.

Responsibilities

• Design, monitor and maintain quality standards for semiconductor assembly and test processes.
• Develop and maintain quality documentation (Control Plans, PFMEA, Process Flow Charts, incoming & outgoing Quality requirements and Work Instructions).
• Lead RCA and CAPA activities; drive corrective actions for quality excursions and customer complaints.
• Support supplier audits and interface with OSAT partners, customers and internal stakeholders on quality issues.

Skills

SPC

FA

PFMEA

CAPA

8D Problem Solving

DOE

Yield Analysis

Reliability Engineering

QMS ISO 9001

IATF 16949

Education

Bachelor's Degree in Electrical/ Electronics/ Mechanical/ Materials Science

Tools

Minitab

JMP

Excel

SQL

Job description

• Design, monitor and maintain the overall quality standards for semiconductor assembly and test processes.
• Develop and maintain quality documentation, including Control Plans, PFMEA, Process Flow Charts, incoming & outgoing Quality requirements and Work Instructions.
• Ensure compliance with customer, industry, internal quality requirements, as well relevant ISO (such as ISO9001).

Core Responsibilities:

• Design, monitor and maintain the overall quality standards for semiconductor assembly and test processes.
• Develop and maintain quality documentation, including Control Plans, PFMEA, Process Flow Charts, incoming & outgoing Quality requirements and Work Instructions.
• Ensure compliance with customer, industry, internal quality requirements, as well relevant ISO (such as ISO9001).

Quality Management

• Design, monitor and maintain the overall quality standards for semiconductor assembly and test processes.
• Develop and maintain quality documentation, including Control Plans, PFMEA, Process Flow Charts, incoming & outgoing Quality requirements and Work Instructions.
• Ensure compliance with customer, industry, internal quality requirements, as well relevant ISO (such as ISO9001).

Problem Solving & Failure Analysis

• Lead root cause analysis (RCA) using 8D, 3x5 Why, Fishbone, and other quality tools.
• Drive corrective and preventive actions (CAPA) for quality excursions and customer complaints.
• Support failure analysis activities and coordinate with engineering teams for resolution.

Process Control & Improvement

• Monitor process capability using SPC methodologies.
• Analyse yield, defect trends, and reliability data.
• Lead continuous improvement projects to reduce defects and improve yield performance.

Supplier & Customer Quality

• Support supplier audits and qualification activities.
• Interface with OSAT partners, customers, and internal stakeholders regarding quality issues at OSAT.
• Manage the change control request review and approval, related to materials, processes, and equipment.

Audits & Compliance

• Conduct internal and external quality audits.
• Support customer audits and certification activities.Ensure compliance with QMS, ISO 9001, (16949), JEDEC, and customer-specific requirements where applicable.

Required Qualifications

• Bachelor's Degree in Electrical Engineering, Electronics Engineering, Materials Science, Mechanical Engineering, Physics, Chemistry, or related field.
• 5+ years of semiconductor assembly and test Quality experience, preferably in OSAT, or IDMs.
• Knowledge of semiconductor packaging technologies such as Flip Chip, BGA, QFN, WLCSP – bumping, fan-out, back-grind, wafer saw, 2.5D/interposer assembly. Wafer & Final Test quality experience is an added advantage.
• Technical Skills:
• Statistical Process Control (SPC)
• Failure Analysis (FA)
• FMEA / PFMEA
• CAPA
• 8D Problem Solving
• DOE (Design of Experiments)
• Yield Analysis & Defect Reduction
• Reliability Engineering
• QMS - ISO 9001, IATF 16949
• Minitab, JMP, Excel, SQL (preferred)

Preferred Skills

• Strong analytical and troubleshooting skills.
• Excellent communication and presentation abilities.
• Experience working with OSAT subcontractors and cross-functional teams.
• Ability to manage multiple projects and drive quality improvements independently.