Staff Engineer (Pkg PE MFG), Heterogeneous Integration Group(HIG), High Bandwidth Memory (HBM)[...]

Micron Technology; Singapore; On-site; SGD 70,000 - 100,000; Full time

Job summary

Micron Technology in Singapore is seeking a qualified candidate with a degree in Electrical, Electronic, or Mechanical Engineering. The role involves improving assembly yield, collaborating on technical initiatives, and mentoring team members. You will handle project management and engage in technical decision-making, promoting innovation and AI/ML applications. Strong technical problem-solving skills and excellent communication are crucial, alongside a commitment to leadership and continuous learning.

Qualifications

• Strong technical skills in problem solving and circuit analysis.
• Good knowledge of statistics and data analysis.
• Excellent communication and presentation skills.

Responsibilities

• Improve assembly related coverage to enhance DPM.
• Collaborate on HBM Cube yield improvement.
• Lead initiatives to enhance cumulative yield.

Skills

Technical problem solving

Data analysis

Communication skills

Project management

Team leadership

Education

Bachelors/Masters in Electrical/Electronic/Mechanical Engineering

Tools

Statistics tools

Scripting

Job description

Key Responsibilities

• ASM Yield and DPM Improvement: Accountable for improving assembly related coverage within the manufacturing flows to improve the Time 0 and Field DPM and reduce/prevent inline fallout within the assembly process.
• HBM Cube Yield Improvement: Improving HBM Cube yield through test optimization and coverages by collaboration with Technology Development and Packaging organizations to reduce Manufacturing Line Yield.
• Cumulative Yield Ownership: Work with cross‑functional teams to lead impactful initiatives that significantly enhance overall cumulative yield and quality improvement, driving substantial benefits for the organization.
• Root Cause and Resolution of Qual and RMA Packaging Issues: Debug and identify root cause and failures in by electric failure analysis (EFA) and Physical Failure Analysis (PFA) and drive for resolution and improvements through cross‑functional team collaboration.
• Backend Process Conversions and HVM: Work with FAB, Technology Development, Advanced Packaging TD, Package Development Teams to establish a robust Process Conversion Business Process to facilitate Yield Improvement, DPM Improvement and overall performance of HBM Products. Provide recommendation to PDE teams for new process conversions to reduce cost and increase yields.
• Mentorship and Development: Actively mentor and develop team members to foster growth and development within the team and the organization.
• Cross‑Functional Collaboration: Work closely with various cross‑functional teams, including Fab, HBM Technology Development, HBM Design, System Development, and Quality/Reliability teams, to ensure the holistic development and successful shipping of end products.
• Promotion of Innovation: Promote innovation and drive changes that provide a technical advantage over competitors, maintaining the company's competitive edge in the market.
• Project Management: Developing project management skills within the team ensures efficient execution of projects, leading to timely delivery of technological solutions.
• Technical Decision Making: The role involves making final decisions on risk analysis and project prioritization. These decisions directly impact the direction of technological development.
• AI/ML Advocate: Collaborate with cross‑functional teams to develop, deploy, and validate AI/ML models aimed at enhancing key performance indicators (KPIs) such as Quality, Cost, Cycle Time, and Scale.

Requirements

• Bachelors/Masters of Electrical/Electronic/Mechanical Engineering Degree.
• Demonstrating competent technical skills, especially in problem solving with root‑cause understanding and solution space through in‑depth circuit analysis.
• Good knowledge of statistics and data analysis tools and scripting.
• Dedicated and highly motivated with a flexible approach towards adapting to different roles in a dynamic working environment (from leading the team to leading technical programs).
• Proven track record of collaborative work within/across teams to address sophisticated business and engineering problems.
• Strong sense of responsibility and accountability towards assigned role with professional work ethic.
• Excellent communication and presentation skills.
• Passionate about people leadership, with a drive toward ongoing learning and development in this area.
• Work on site in Singapore with international travel to Taiwan, US, Japan.

Equal Employment Opportunity Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.