Staff NAND Dry-Etch Engineer: Innovation Leader

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.

Singapore

On-site

SGD 110,000 - 170,000

Full time

5 days ago
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Job summary

Micron Semiconductor Asia Operations Pte. Ltd. in Singapore seeks a Staff/Senior engineer to join the dry etch R&D team for next-generation NAND development, collaborating with Wet etch, CVD, Diffusion, Metals, Lithography and CMP.

You will own the process roadmap, develop and optimize dry etch processes, perform root-cause analyses, and partner with process integration to meet yield goals. AI-enabled tools are encouraged and travel may be required.

Qualifications

  • MS + 3-4 years of relevant experience involving dry etch in semiconductor industry.
  • BS (Chemical, Mechanical, Electrical, Material Science, Physics, Chemistry, Semiconductor engineering or related majors) + 5 years of relevant experience in dry etch.
  • PhD + 1-2 years in Chemical, Mechanical, Electrical, Material Science, Physics, Semiconductor engineering or related majors.

Responsibilities

  • Developing dry etch processes to meet physical and electrical requirements of Micron's products.
  • Optimizing dry etch processes to reduce cost and variability, and improve process capability.
  • Collaborating with process integration and other teams to develop innovative solutions.
  • Conducting root-cause and failure mode analyses to understand limitations and drive solutions.
  • Performing fundamental research to advance next-generation products.
  • Maintaining a technology development pilot manufacturing line.
  • Support process transfer to production facilities; some domestic and international travel may be required.

Skills

R&D aptitude
Data analysis
Problem solving
Python
GenAI
MS Office
Statistical analysis
Independent work

Education

MS + 3-4 years dry etch semiconductor
BS + 5 years dry etch
PhD + 1-2 years related majors

Job description

Micron Semiconductor Asia Operations Pte. Ltd. in Singapore seeks a Staff/Senior engineer to join the dry etch R&D team for next-generation NAND development, collaborating with Wet etch, CVD, Diffusion, Metals, Lithography and CMP.

You will own the process roadmap, develop and optimize dry etch processes, perform root-cause analyses, and partner with process integration to meet yield goals. AI-enabled tools are encouraged and travel may be required.

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