Sr Engineer, Process Integration, NAND NTI

Micron Technology; Singapore; On-site; SGD 70,000 - 90,000; Full time

Job summary

Micron Technology in Singapore is looking for a professional passionate about semiconductor technology to lead projects addressing key module deficiencies and technology gaps. This role requires strong data analysis and problem-solving skills while working with cross-functional teams.

The ideal candidate will have a PhD in a related field and experience in the semiconductor industry. Responsibilities include coordinating manufacturing activities and supporting the transfer of technologies from R&D. This position promotes innovation and optimization within a dynamic environment.

Qualifications

• Passionate about semiconductor technology and innovation.
• Experience in semiconductor R&D product life cycle from design to manufacturing.
• Ability to develop a holistic understanding of PI modules on new NAND technologies.

Responsibilities

• Identify and quantify key module deficiencies and technology gaps.
• Lead cross-functional teams to address key technology gaps.
• Assist in the transfer of new technology from R&D to manufacturing.

Skills

Data analysis

Problem-solving

Process integration optimization

Communication skills

Education

PhD in Material Science, Electrical Engineering, Microelectronics, Chemical or Physics Engineering

Tools

JMP

Tableau

Job description

Responsibilities

• Identify and quantify key module deficiencies and technology gaps. Lead cross‑functional teams to address these issues. Improve current process flows and develop innovative solutions to meet product requirements and manufacturability.
• Develop or redefine CSPEC criteria for optimal product performance and drive activities to ensure manufacturing process capability.
• Coordinate activities at the manufacturing site to secure funding for experiments and conversions, and optimally communicate decisions to relevant R&D, Product Engineering, and Manufacturing partners.
• Undertake development projects to evaluate and implement new integration schemes for alpha and derivative part types; establish proof of concept for future tech nodes at the manufacturing facility.
• Lead at quarterly yield summits and monthly program reviews to summarize complex problems, explain actions taken to address them, and align R&D, Manufacturing, and senior management teams.
• Assist in the transfer of new technology from R&D to manufacturing, ensuring a successful ramp‑up and qualification; support the transfer, documentation, and training of module fundamentals into manufacturing.

Qualifications

• Passionate about semiconductor technology and innovation.
• Adept at data analysis, problem‑solving, and process integration optimization.
• Excellent communication skills and ability to work in cross‑functional teams.

Preferred Skills / Experience

• PhD in Material Science, Electrical Engineering, Microelectronics, Chemical or Physics Engineering, or a related field.
• 2 years of experience in the semiconductor industry is an advantage.
• Proficiency in data analysis, visualization or simulation software such as JMP, Tableau.
• Ability to develop a holistic end‑to‑end understanding of PI modules on new NAND technologies and related structural & electrical fail mechanisms.
• In‑depth knowledge and direct experience with non‑volatile memories (NAND) along with good understanding of the NAND process flow, the interaction of process & device, common yield & reliability issues.
• Experience in semiconductor R&D product life cycle from design to manufacturing.
• Ability to be self‑motivated, self‑governing with proven ability to work in a demanding & dynamic environment.

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.