Engineer, NAND PI

1100 Micron SemiAsiaOP Pte Ltd; Singapore; On-site; SGD 70,000 - 100,000; Full time

Job summary

1100 Micron SemiAsiaOP Pte Ltd is looking for a NAND Module Process Integration Engineer in their Singapore R&D department. This role is key to designing and implementing innovative processes to enhance 3D NAND product quality and yield.

The ideal candidate has a strong background in electrical or chemical engineering and experience in semiconductor R&D. You will lead cross-functional teams, innovate solutions, and ensure seamless technology transfers from R&D to production.

Qualifications

• Passion for semiconductor technology and innovation.
• Experience in R&D and technology transfer in the semiconductor industry.
• Basic knowledge of NAND devices and common yield issues.

Responsibilities

• Lead process modules for 3D NAND development.
• Define specifications and address potential issues proactively.
• Support technology transfer from R&D to manufacturing.

Skills

Data analysis

Problem-solving

Process integration optimization

Collaboration

Education

Bachelor’s, Master’s, or Ph.D. in relevant engineering field

Tools

Python

SolidWorks

Tableau

Power BI

Job description

Job Overview

We are seeking a NAND Module Process Integration Engineer in the Singapore R&D department at Micron Technology Inc. The role focuses on designing, developing, integrating, and implementing innovative process solutions to improve next‑generation 3D NAND product yield and quality while maintaining competitive cost and performance.

Responsibilities

• Lead one or more process modules related to the development and operation of a 3D NAND semiconductor integrated circuit (Module Ownership).
• Define structural specifications and process requirements for assigned modules (Specification Definition).
• Set a clear direction and vision for the module with a well‑defined continual improvement plan (Strategic Direction).
• Identify and address potential structural, electrical, and reliability issues early through process control and model‑based problem solving (Proactive Issue Resolution).
• Focus on structural development, electrical performance, parametric verification, and manufacturability assessment and optimization (Performance Optimization).
• Analyze materials, collaborate with process groups, and select new materials for development, driving changes from research into production (Material Innovation).
• Design and implement device and process experiments, analyze data, and report logical conclusions with statistical significance (Design Experiments).
• Provide team leadership, assemble and coordinate a development team including process engineers, and set clear goals and metrics (Team Leadership & Decision‑Making).
• Innovate to address complex problems through design and process, generating intellectual property and submitting patent disclosures regularly (Innovation & IP Generation).
• Coordinate activities such as reticle tapeouts, flow changes, and lot management across multi‑functional teams to advance projects rapidly and with minimal error (Multi‑Functional Coordination).
• Support the transfer of new technology from R&D to high volume manufacturing (Technology Transfer).
• Communicate key information and projects through presentations and group discussions to drive decisions (Communication & Influence).
• Continuously grow technical and management skills and pursue ongoing education via on‑job training and training classes (Continuous Development).

Qualifications

• Passionate about semiconductor technology and innovation.
• Proficient in data analysis, problem‑solving, and process integration optimization.
• Excellent communication skills and ability to collaborate within multi‑functional teams.
• Bachelor’s, Master’s, or Ph.D. in Electrical Engineering, Microelectronics, Chemical Engineering, Material Science, or a related field.
• Experience in R&D and technology transfer within the semiconductor industry.
• Basic knowledge of NAND devices, NAND process flow, and common yield and reliability issues.
• Proficiency in scripting, programming, engineering, or business intelligence/analytics software such as Python, SolidWorks, Tableau, or Power BI (desirable).
• Strong holistic end‑to‑end understanding of PI modules on new NAND technologies and related structural and electrical failure mechanisms.
• Commitment to quality, collaboration, and continuous improvement.
• Self‑motivated, self‑governing, and proven ability to work in a demanding, dynamic environment.

Equal Employment Opportunity

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.