Singapore-based Senior 3D/2.5D Packaging Lead

GlobalFoundries inc.; Singapore; On-site; SGD 180,000 - 250,000; Full time

Job summary

GlobalFoundries in Singapore seeks a Senior Advanced Packaging 3DHi and 2.5D Integration Lead to drive architecture, qualification, and manufacturing transfer for chiplet-based 3D/2.5D packaging solutions. You will own integration strategy, test vehicles, DOEs, and cross‑functional execution with global teams.

You will collaborate with engineering, manufacturing, reliability, test, supply‑chain, and business teams to deliver critical technology milestones and enable high‑volume production

Qualifications

• Bachelor's degree or higher in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, Physics or related technical field.
• Demonstrated hands‑on expertise leading integration of 3DHi and/or 2.5D solutions with chiplet architectures, TSV, redistribution layers, and advanced bonding.
• Experience defining and executing test vehicles, DOEs, metrology and inspection plans, electrical test, reliability qualification, failure analysis, yield improvement, and manufacturing transfer.
• Proven leadership, programme ownership, and ability to drive execution across cross‑functional teams, global sites, suppliers, and partners.

Responsibilities

• Serve as the lead integrator for complex 3DHi and 2.5D technology development programs, translating customer requirements into architecture, qualification strategies, and roadmaps.
• Define end‑to‑end process flows for chiplet-based 2.5D and 3DHi solutions, including interposers, TSVs, redistribution layers, bonding, thinning and package integration.
• Own trade‑off analysis across electrical, power, signal, thermal, mechanical, reliability, yield, and cost.
• Define test-site requirements and lead development of test structures, reliability structures, and electrical test methodologies.
• Establish process control, metrology, defectivity, known-good-die, assembly and qualification strategies for robust development and high‑volume readiness.
• Identify gaps and failure mechanisms; develop DOEs and data‑driven plans to determine root cause and accelerate maturity.
• Analyze data to identify trends, define corrective actions, and enable rapid technical decisions.
• Lead cross‑functional execution through architecture alignment, DOE planning, qualification readiness and manufacturing transfer.
• Provide technical leadership and communicate risks and recommendations to management and partners.
• Build strong relationships across Singapore and GF’s global teams.

Skills

3DHi integration

2.5D integration

chiplet architectures

silicon interposers

TSV integration

bonding (hybrid/Cu-Cu)

die-to-wafer

wafer-to-wafer

wafer thinning

assembly and package qualification

test structures and DOEs

cross-functional leadership

Education

Bachelor's degree or higher in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, Physics

Job description

GlobalFoundries in Singapore seeks a Senior Advanced Packaging 3DHi and 2.5D Integration Lead to drive architecture, qualification, and manufacturing transfer for chiplet-based 3D/2.5D packaging solutions. You will own integration strategy, test vehicles, DOEs, and cross‑functional execution with global teams.

You will collaborate with engineering, manufacturing, reliability, test, supply‑chain, and business teams to deliver critical technology milestones and enable high‑volume production