Senior 3D/2.5D Packaging & Chiplet Integration Lead

globalfoundries singapore pte. ltd.; Singapore; On-site; SGD 180,000 - 280,000; Full time

Job summary

GlobalFoundries Singapore is seeking a Senior Advanced Packaging 3DHi and 2.5D Integration Lead. Based in Singapore, you will drive architecture, qualification, and production readiness for complex 3DHi/2.5D packaging programs, coordinating with engineering, manufacturing, reliability, and supply-chain teams.

The role requires hands-on expertise in chiplet integration, TSVs, interposers, and advanced bonding techniques, with ownership of architecture, test vehicles, DOE planning, and

Qualifications

• Bachelor’s degree or higher in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, Physics, or related field.
• 10+ years of relevant experience for B.S. level; 7+ years for M.S.; 5+ years for Ph.D. in advanced semiconductor packaging.
• Hands-on experience leading integration of 3DHi and/or 2.5D solutions (chiplet architectures, TSVs, interposers, redistribution layers).
• Experience defining test vehicles, DOEs, metrology plans, reliability qualification, and manufacturing transfer.

Responsibilities

• Serve as lead integrator for 3DHi/2.5D programs; translate requirements into architectures and roadmaps.
• Define end-to-end process flows for chiplet-based 2.5D/3DHi; manage bonding, thinning, assembly, and packaging.
• Own trade-off analyses across electrical, thermal, mechanical, and cost factors.
• Define test-site requirements; develop test structures, interposers, daisy chains, and reliability structures.

Skills

3DHi integration

2.5D solutions

chiplet architectures

TSV integration

hybrid bonding

test structures & DOE

cross‑functional leadership

communication in English

Education

Bachelor’s degree or higher in Electrical Engineering

MS with 7+ years experience

PhD with 5+ years experience

Job description

GlobalFoundries Singapore is seeking a Senior Advanced Packaging 3DHi and 2.5D Integration Lead. Based in Singapore, you will drive architecture, qualification, and production readiness for complex 3DHi/2.5D packaging programs, coordinating with engineering, manufacturing, reliability, and supply-chain teams.

The role requires hands-on expertise in chiplet integration, TSVs, interposers, and advanced bonding techniques, with ownership of architecture, test vehicles, DOE planning, and