Singapore-Based Packaging Engineer: 2.5D & Deep-Trench

GLOBALFOUNDRIES SINGAPORE PTE. LTD.; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

GLOBALFOUNDRIES SINGAPORE PTE. LTD. is seeking a Singapore-based Advanced Packaging 2.5D and Deep Trench Integration Engineer to drive integration for 2.5D solutions and deep trench technologies.

You will coordinate module interfaces, execute experiments, analyze data, and support manufacturability improvements. Based in Singapore, you will collaborate with local and global teams to achieve milestones, manage cross-functional deliverables, and present technical findings to project teams and

Qualifications

• Bachelor’s degree or higher in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, Physics, or related field.
• 5+ years of relevant experience (BS); 3+ years (MS); PhD with relevant experience could apply.
• Hands-on deep trench integration and/or 2.5D technology development experience.

Responsibilities

• Support and drive process integration for 2.5D and deep trench programs; translate requirements into plans and deliverables.
• Integrate deep trench modules: trench formation, dielectric, electrode materials, fill, planarization, thermal processing, isolation, contact formation, electrical characterization.
• End-to-end integration of 2.5D: silicon interposers, TSVs, redistribution layers, wafer thinning, bonding, package integration.
• Plan and execute test structures, process splits, structured DOEs to establish process windows and identify risks.
• Analyze inline, physical, electrical, defectivity, yield, and reliability data; identify trends and corrective actions.
• Collaborate with module, device, design, reliability, test, manufacturing, and equipment teams to resolve issues.

Skills

Semiconductor process integration

2.5D technologies

Deep trench integration

Cross-functional teamwork

English communication

Education

Bachelor’s degree or higher in Electrical Engineering

Bachelor’s degree or higher in Materials Science

Bachelor’s degree or higher in Mechanical Engineering

Bachelor’s degree or higher in Chemical Engineering

Bachelor’s degree or higher in Physics

Tools

None

Job description

GLOBALFOUNDRIES SINGAPORE PTE. LTD. is seeking a Singapore-based Advanced Packaging 2.5D and Deep Trench Integration Engineer to drive integration for 2.5D solutions and deep trench technologies.

You will coordinate module interfaces, execute experiments, analyze data, and support manufacturability improvements. Based in Singapore, you will collaborate with local and global teams to achieve milestones, manage cross-functional deliverables, and present technical findings to project teams and