Advanced Packaging Test Engineer - 2.5D/3D Yield

GlobalFoundries inc.; Singapore; On-site; SGD 70,000 - 110,000; Full time

Benefits offered by this job

Mentorship program

Networking opportunities

Leadership development

Job summary

GLOBALFOUNDRIES SINGAPORE PTE. LTD.

- FAB 3 seeks a motivated Test Engineer to support electrical test, product characterization, and yield-learning activities for 2.5D/3D heterogeneous integration technologies including chiplet-based packages and TSV structures. The role offers hands-on exposure to advanced packaging development and requires collaboration with integration, design, process, product, reliability, equipment, and manufacturing teams.

Qualifications

• Basic understanding of semiconductor devices, electrical measurements and data interpretation.
• Ability to analyze structured datasets using Excel or Python/JMP/MATLAB.
• Strong problem-solving skills and attention to detail; willingness to learn new technologies.

Responsibilities

• Develop, validate, and release electrical test methods for wafers, dies, interposers and advanced packaging test vehicles.
• Conduct electrical characterization and data collection across process/product development lots.
• Support probe cards, sockets, load boards, interface hardware and fixtures used for wafer- and package-level testing.
• Analyze test results to identify trends, failure signatures and yield-loss mechanisms; summarize findings for reviews.
• Assist in failure isolation and coordinate with cross-functional teams to verify corrective actions.

Skills

Electrical measurements

Data analysis

Cross-functional teamwork

Communication skills

Education

Bachelor's degree in Electrical Engineering

Tools

Excel

Python

MATLAB

JMP

Job description

GLOBALFOUNDRIES SINGAPORE PTE. LTD.

- FAB 3 seeks a motivated Test Engineer to support electrical test, product characterization, and yield-learning activities for 2.5D/3D heterogeneous integration technologies including chiplet-based packages and TSV structures. The role offers hands-on exposure to advanced packaging development and requires collaboration with integration, design, process, product, reliability, equipment, and manufacturing teams.