Advanced Packaging Engineer - 2.5D & Deep Trench Integration

GlobalFoundries inc.; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

GlobalFoundries inc. in Singapore seeks an Advanced Packaging 2.5D and Deep Trench Integration Engineer to drive integration from early process development to manufacturing readiness.

Based on-site, you will coordinate module interfaces, plan experiments, and analyze data across silicon interposers, TSVs, and package-level integration. You will collaborate with engineering and manufacturing teams locally and across GlobalFoundries’ sites, documenting procedures, presenting findings, and

Qualifications

• Bachelor’s degree or higher in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, Physics, or a related technical field.
• Relevant experience in semiconductor process integration, device integration, advanced packaging, or technology development.
• Hands-on experience in deep trench integration and/or 2.5D technology development.
• Ability to plan and execute experiments and analyze technical data.
• Strong written and verbal communication skills in English.

Responsibilities

• Support and drive process integration for 2.5D and deep trench technology development programmes.
• Integrate deep trench process modules and perform electrical characterisation.
• Support end-to-end integration of 2.5D solutions including silicon interposers and TSVs.
• Plan and execute test structures, DOEs, and process windows.
• Analyse data to identify trends and propose corrective actions.
• Collaborate with cross-functional teams to resolve integration issues and improve manufacturability.
• Develop integration documentation and milestone updates.
• Present findings to project teams and management.
• Build relationships across Singapore and GlobalFoundries sites.

Skills

Deep trench integration

2.5D technology

Electrical characterization

Experiment planning

Cross-functional collaboration

Education

Bachelor’s degree or higher in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, Physics, or related field

Advanced degree preferred (MS/PhD)

Tools

Metrology equipment

Wafer thinning

TSV interposer knowledge

Job description

GlobalFoundries inc. in Singapore seeks an Advanced Packaging 2.5D and Deep Trench Integration Engineer to drive integration from early process development to manufacturing readiness.

Based on-site, you will coordinate module interfaces, plan experiments, and analyze data across silicon interposers, TSVs, and package-level integration. You will collaborate with engineering and manufacturing teams locally and across GlobalFoundries’ sites, documenting procedures, presenting findings, and