Lead Silicon Photonics Process Engineer – Thinning & Dicing

lumilens; Singapore; On-site; SGD 70,000 - 100,000; Full time

Job summary

lumilens is seeking a skilled process engineer in Singapore focused on the silicon photonics field. The successful candidate will be responsible for the wafer backside grinding/thinning and development processes, ensuring quality and efficiency.

Candidates will need a Bachelor's or Master's in a relevant engineering discipline, alongside at least 3 years of process engineering experience. The company offers a dynamic work environment focused on innovation and quality in advanced packaging.

Qualifications

• 3 to 6+ years of hands-on process engineering experience.
• Familiarity with SPC, JMP data analysis, and DOE matrix design.
• Experience with advanced packaging wafers.

Responsibilities

• Optimize wafer thinning thickness and grinding speed.
• Monitor wafer thickness uniformity and production capacity.
• Compile process SOP, WI, and engineering change documents.

Skills

Process engineering

Wafer thinning

Wafer dicing

Data analysis

Problem-solving

Education

Bachelor or Master degree in Materials Science

Bachelor or Master degree in Chemical Engineering

Bachelor or Master degree in Mechanical Engineering

Bachelor or Master degree in Microelectronics

Job description

lumilens is seeking a skilled process engineer in Singapore focused on the silicon photonics field. The successful candidate will be responsible for the wafer backside grinding/thinning and development processes, ensuring quality and efficiency.

Candidates will need a Bachelor's or Master's in a relevant engineering discipline, alongside at least 3 years of process engineering experience. The company offers a dynamic work environment focused on innovation and quality in advanced packaging.