Senior Staff NAND Process Integration Engineer – Module Lead

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE LTD; Singapore; Presencial; SGD 180.000 - 250.000; Jornada completa

Descripción de la vacante

Micron Technology, Inc. is seeking a highly skilled professional to lead module development for 3D NAND processes in Singapore.

You will define specifications, set strategic direction, and drive improvements across multiple teams, ensuring robust process control and high-quality results. The role emphasizes collaboration with R&D and manufacturing transfer, with a focus on material science, electrical performance, and reliability.

Formación

• 5+ years of experience in Wafer Fabrication Process Development (Dry Etch, Photolithography, Films, Wet Process, CMP or Process Integration).
• Strong understanding of NAND technologies, process flow, and yield/reliability issues.
• Experience in R&D and technology transfer to manufacturing.

Responsabilidades

• Module Ownership: Lead one or more process modules related to development and operation of 3D NAND semiconductor circuits.
• Define structural specifications and process requirements for assigned modules.
• Set a clear direction and vision for the module with a continual improvement plan.
• Identify potential structure, electrical, and reliability issues early and address them with process control.

Conocimientos

Data analysis

Problem solving

Cross-functional collaboration

Educación

Masters/PhD in Electrical Engineering, Microelectronics, Chemical Engineering, Material Science

Herramientas

Python

SolidWorks

Tableau

Power BI

Descripción del empleo

Micron Technology, Inc. is seeking a highly skilled professional to lead module development for 3D NAND processes in Singapore.

You will define specifications, set strategic direction, and drive improvements across multiple teams, ensuring robust process control and high-quality results. The role emphasizes collaboration with R&D and manufacturing transfer, with a focus on material science, electrical performance, and reliability.