Senior Reliability Engineer, AI & Advanced Packaging

Advanced Micro Devices; Singapore; Hybrid; SGD 90,000 - 140,000; Full time

Benefits offered by this job

AMD benefits at a glance

Hybrid work model

Job summary

Advanced Micro Devices (AMD) in Singapore is seeking a proactive reliability expert to lead reliability strategies for next-generation AI products, spanning silicon photonics, advanced packaging, and high-speed I/O. You will define qualification plans, drive cross-functional execution, and deliver data-driven improvements across device, package, and system levels.

You will collaborate with Reliability, Design, Packaging, and Manufacturing teams to tackle challenging reliability problems, conduct

Qualifications

• Experience in reliability, qualification, photonics, high-speed interconnect, semiconductor, or datacenter technologies.
• Experience in semiconductor devices, advanced packaging, Silicon Photonics, optical interconnects, high-speed I/O, or board/system-level reliability.
• Strong knowledge of reliability qualification methodologies, accelerated stress testing, reliability modeling, failure analysis, and standards (JEDEC, GR-468, IPC).
• Experience driving NPI qualification and product readiness, including risk assessment and cross-functional execution.
• Strong analytical and problem-solving skills with reliability data analysis, root cause investigation, FMEA, DOE, and CAPA.
• Collaborate across Reliability, Design, Product Engineering, Quality, Manufacturing, Supply Chain, and external partners for robust products.

Responsibilities

• Own and drive reliability strategies for next-generation AI products including Silicon Photonics, CPO, advanced packaging, and high-speed I/O technologies.
• Define and execute qualification and reliability test plans for industry-leading AI and datacenter products.
• Develop, optimize, and automate board, system, package, optical, and AI reliability methodologies for product readiness.
• Solve complex reliability challenges through advanced characterization, failure analysis, and data-driven insights.
• Analyze reliability data and translate insights into improvements that enhance product quality and robustness.
• Influence technology and product development decisions through data-driven engineering recommendations and reliability expertise.
• Drive continuous innovation in reliability engineering to enable AI, datacenter, networking, and optical connectivity solutions.

Skills

Reliability

Semiconductor

Packaging

Photonic devices

High-speed interconnect

Education

Bachelor’s degree in Electrical/Electronics Engineering, Computer Engineering, Optics & Photonics Engineering, or comparable disciplines

Tools

Optical test equipment

Electrical test equipment

Job description

Advanced Micro Devices (AMD) in Singapore is seeking a proactive reliability expert to lead reliability strategies for next-generation AI products, spanning silicon photonics, advanced packaging, and high-speed I/O. You will define qualification plans, drive cross-functional execution, and deliver data-driven improvements across device, package, and system levels.

You will collaborate with Reliability, Design, Packaging, and Manufacturing teams to tackle challenging reliability problems, conduct