Senior PVD Packaging Technologist

Applied Materials; Singapore; On-site; SGD 180,000 - 240,000; Full time

Benefits offered by this job

Relocation assistance

Travel 50%

Job summary

Applied Materials, Inc. in Singapore is seeking an experienced semiconductor equipment/process engineer with deep PVD expertise in Advanced Packaging (FO-WLP, 2.5D/3D, RDL/UBM).

The role focuses on direct engagement with OSATs and Fabless design houses to define material stacks and ensure manufacturing alignment. You will lead qualification programs, drive yields, and collaborate with Product Engineering, Field Service, and Quality teams to deliver robust, reliable solutions.

Qualifications

• Minimum of a Bachelor’s or Master’s in Materials Science, Physics, Chemical Engineering, or related field; PhD preferred.
• 10+ years in semiconductor equipment/process engineering with strong PVD experience in Advanced Packaging (FO-WLP, 2.5D/3D, RDL/UBM).
• Proven ability to enable solutions through direct engagement with OSATs and Fabless design houses.

Responsibilities

• Act as the technical owner for PVD solutions at assigned OSATs and Fabless accounts, ensuring alignment between design requirements and manufacturing processes.
• Understand Customers and Fabless stakeholders' technical roadmap.
• Lead joint qualification programs involving Fabless and OSAT stakeholders: define success metrics, DoEs, and acceptance gates; manage execution to schedule.
• Coordinate with Applied Materials’ Product Engineering, Field Service, and Quality teams to deliver robust solutions tailored to OSAT and Fabless needs.
• Resolve integration challenges across packaging flows (e.g., ESD, adhesion, contamination, stress) through structured problem-solving.
• Lead structured root cause analysis on yield/reliability excursions; implement corrective actions and verify effectiveness.

Skills

PVD experience

OSAT engagement

Packaging knowledge

Yield analytics

Education

Bachelor’s or Master’s in Materials Science, Physics, Chemical Engineering

PhD preferred

Job description

Applied Materials, Inc. in Singapore is seeking an experienced semiconductor equipment/process engineer with deep PVD expertise in Advanced Packaging (FO-WLP, 2.5D/3D, RDL/UBM).

The role focuses on direct engagement with OSATs and Fabless design houses to define material stacks and ensure manufacturing alignment. You will lead qualification programs, drive yields, and collaborate with Product Engineering, Field Service, and Quality teams to deliver robust, reliable solutions.