Senior Process Engineer, Advanced Packaging

GlobalFoundries inc.; Singapore; On-site; SGD 90,000 - 150,000; Full time

Job summary

GlobalFoundries Singapore seeks an Experienced Equipment Engineer to join our 300mm Advance Packaging Center. You will develop and optimize bonding and debonding, pre-bond plasma/UV/cleaning, die re-constitution, annealing and TSV processes across multi-stack wafers.

You will design experiments, start up new equipment, and work with the Equipment and Quality teams to ensure reliability and yield targets while maintaining safety and process control.

Qualifications

• Requires BS/ MS in Electrical, Chemical Engineering, Science or related field.
• Experience with Bonder (TEL W2W/BESI D2W), die re-constitution and annealing tools.
• Strong verbal and written communication skills.
• Excellent interpersonal skills and ability to work with diverse teams.

Responsibilities

• Design, execute, and analyze experiments to develop advanced packaging etch processes targeting performance, yield and reliability.
• Startup and qualify new processes and equipment within scheduled timelines.
• Improve process robustness for high-volume manufacturing using DOE, data-driven decisions and Six Sigma concepts.
• Collaborate with equipment team to improve productivity and tool matching.

Skills

Engineering knowledge

Communication skills

Interpersonal skills

Problem solving

Education

Bachelor's or Master's in Electrical/Chemical/Science

Tools

TEL W2W

BESI D2W

Alpha 303

Mattson-Helios

Job description

GlobalFoundries Singapore seeks an Experienced Equipment Engineer to join our 300mm Advance Packaging Center. You will develop and optimize bonding and debonding, pre-bond plasma/UV/cleaning, die re-constitution, annealing and TSV processes across multi-stack wafers.

You will design experiments, start up new equipment, and work with the Equipment and Quality teams to ensure reliability and yield targets while maintaining safety and process control.