Senior PVD Packaging Solutions Engineer (OSAT/Fabless)

0091 Applied Materials Singapore Technology Pte. Ltd.; Singapore; On-site; SGD 180,000 - 240,000; Full time

Job summary

Applied Materials, Inc. in Singapore is seeking a senior semiconductor equipment/packaging expert to lead PVD solutions for OSATs and fabless accounts.

You will define material stacks, reliability criteria, and integration flows to deliver executable packaging solutions. In this role, you will manage joint qualification programs, establish process-of-records for advanced packaging, and drive tool acceptance and high-volume ramp at OSAT sites, coordinating with product engineering, field service,

Qualifications

• Bachelor’s or Master’s in Materials Science, Physics, Chemical Engineering, or related field; PhD preferred.
• 10+ years in semiconductor equipment/process engineering with strong PVD experience in Advanced Packaging (FO-WLP, 2.5D/3D, RDL/UBM).
• Proven success enabling solutions through direct engagement with OSATs and Fabless design houses.

Responsibilities

• Act as technical owner for PVD solutions at OSATs and Fabless.
• Define material stacks, reliability criteria, and integration flows; translate these into executable solutions for OSATs.
• Lead joint qualification programs involving Fabless and OSAT stakeholders: define success metrics, DoEs, and acceptance gates; manage execution to schedule.
• Process Qualification & Ramp: Establish POR for advanced packaging applications (e.g., RDL barrier/seed, TSV liners, hybrid bonding underlayers).
• Drive tool acceptance (FAT/SAT) and HVM ramp at OSAT sites: SPC setup, chamber matching, defectivity control, and yield stabilization.
• Validate PVD film integrity under Fabless-driven reliability tests (JEDEC/IPC standards: EM, TDDB, thermal cycling).
• Cross-Functional Collaboration: Coordinate with Applied Materials’ Product Engineering, Field Service, and Quality teams to deliver robust solutions tailored to OSAT and Fabless needs.
• Resolve integration challenges across packaging flows (e.g., ESD, adhesion, contamination, stress) through structured problem-solving.
• Continuous Improvement: Lead structured root cause analysis on yield/reliability excursions; implement corrective actions and verify effectiveness.
• Provide feedback to internal engineering for hardware and process enhancements based on OSAT and Fabless requirements.

Skills

PVD process engineering

Advanced packaging

OSAT engagement

DOE execution

SPC

Yield analytics

Education

Bachelor’s in Materials Science, Physics, or Chemical Engineering

Master’s degree

PhD preferred

Tools

SPC

DOE

Metrology tools

Yield analytics tools

PVD system knowledge

Job description

Applied Materials, Inc. in Singapore is seeking a senior semiconductor equipment/packaging expert to lead PVD solutions for OSATs and fabless accounts.

You will define material stacks, reliability criteria, and integration flows to deliver executable packaging solutions. In this role, you will manage joint qualification programs, establish process-of-records for advanced packaging, and drive tool acceptance and high-volume ramp at OSAT sites, coordinating with product engineering, field service,