Senior Principal Process Engineer - Advanced Packaging

ASM; Singapore; On-site; SGD 180,000 - 240,000; Full time

Job summary

ASM is seeking a Principal / Senior Process Engineer to advance semiconductor process technologies through thin‑film deposition and materials characterization. You will develop innovative solutions for next‑generation devices, influencing product performance across logic, memory, and power applications.

You will lead R&D on advanced packaging processes (ALD/PECVD/PVD), run DOE/RSM studies, mentor engineers, and collaborate with customers and marketing to define requirements.

Qualifications

• Minimum Master’s or PhD in Chemical Engineering, Materials Science, Electrical Engineering, or Physics.
• Direct experience with D2W/W2W Hybrid bonding including surface preparation steps.
• 10 years of combined education, research, and work experience in thin-film deposition (ALD, CVD, PECVD) and advanced packaging processes.
• Proficiency in materials characterization techniques (XPS, SIMS, RBS, AFM, XRR, XRD, TEM, SEM, ellipsometry).
• Knowledge of electrical characterization techniques for CMOS devices.
• Ability to manage complex process development projects, including schedules, budgets, and personnel.

Responsibilities

• Research and optimize Advanced Packaging processes, including ALD/PECVD/PVD/ECP and surface prep.
• Design and conduct complex experiments using DOE and RSM methodologies; interpret and analyze experimental data.
• Develop new films or processes for W2W/D2W Hybrid bonding and perform advanced materials characterization.
• Provide mentorship to Process Engineers and lead technical problem-solving sessions.
• Collaborate with customers and marketing teams to define requirements and demonstrations.
• Troubleshoot equipment issues and ensure successful product transfer to customers.
• Draft technical papers, generate Intellectual Property, and present findings.
• Travel up to 10% to support remote sites and customer engagements.
• May supervise process engineering technicians and provide input on performance evaluations.

Skills

D2W/W2W Hybrid bonding

Thin-film deposition

Materials characterization

Electrical CMOS characterization

Project management

Education

Master’s or PhD in Chemical Engineering, Materials Science, Electrical Engineering, or Physics

Job description

ASM is seeking a Principal / Senior Process Engineer to advance semiconductor process technologies through thin‑film deposition and materials characterization. You will develop innovative solutions for next‑generation devices, influencing product performance across logic, memory, and power applications.

You will lead R&D on advanced packaging processes (ALD/PECVD/PVD), run DOE/RSM studies, mentor engineers, and collaborate with customers and marketing to define requirements.