Manager, Process Engineer

applied materials singapore technology pte. ltd.; Singapore; On-site; SGD 180,000 - 240,000; Full time

Job summary

Applied Materials Singapore Technology Pte. Ltd.

seeks a senior leader to drive development and scaling of next‑generation advanced packaging technologies, leveraging PVD, CVD, and ALD to support customer roadmaps and resolve key technical challenges. You will manage engineers, collaborate with customers and research organizations, address high-value process engineering problems, and ensure compelling product demonstrations.

Qualifications

• Deep technical expertise in semiconductor thin-film deposition and materials engineering.
• Strong understanding of packaging applications and process integration.
• Experience supervising or managing teams.

Responsibilities

• Lead development and scaling of next-generation advanced packaging technologies using PVD/CVD/ALD.
• Drive roadmaps for advanced packaging and 3D integration with customers and cross-functional teams.
• Manage engineers in hardware characterization and applying new technologies.
• Interface with key customers to address high-value process engineering problems.
• Ensure effective product and technology demonstrations.
• Collaborate with executives and managers to execute strategic plans.
• Lead market share improvement efforts.

Skills

Semiconductor

Thin-film deposition

PVD/CVD/ALD

Team leadership

Problem solving

Job description

Key Responsibilities

• Lead the development and scaling of next-generation advanced packaging technologies, leveraging expertise in thin film deposition processes including Physical Vapor Deposition (PVD), Chemical Vapor Deposition (CVD), and/or Atomic Layer Deposition (ALD) to enable customer roadmaps and address critical technology challenges.

• Drive process and technology roadmap development for advanced packaging, 3D integration, and related semiconductor applications through collaboration with customers, research organizations, and cross-functional engineering teams.

• Manage engineers in utilizing techniques to characterize hardware, define methods and new technologies and apply them to characterize hardware, and/or perform hardware characterization on extremely complex systems for entire range of products for division

• Interact with key customers to resolve extremely complex process engineering issues to address customers High Value Problems (HVP) for an entire range of products for the division

• Ensures effective product/technology demonstrations

• Leads collaboration efforts with executive managers and junior managers to ensure strategic execution

• Leads market share improvement efforts

Functional Knowledge

• Demonstrates comprehensive understanding of concepts and principles within own job family and knowledge of other related job families

• Possesses deep technical expertise in semiconductor thin-film deposition technologies, including PVD, CVD, and/or ALD, and a strong understanding of materials engineering, process integration, and advanced packaging applications.

• Demonstrates knowledge of advanced packaging technologies, TSV, hybrid bonding, wafer-level packaging, and related semiconductor manufacturing processes.

• Demonstrated experiences in supervisory or management capacity.

• Outstanding communication and interpersonal skills with the ability to influence internally and externally, including senior management

• Problem-solver attitude with determination and quality-mindset management

Work Location

• Science Park II (Moving to Tampines from Apr 2027)